Journal ArticleDOI
On-chip cooling by superlattice-based thin-film thermoelectrics
Ihtesham Chowdhury,Ravi Prasher,Ravi Prasher,Kelly Lofgreen,Gregory M. Chrysler,Sridhar Narasimhan,Ravi Mahajan,David A. Koester,Randall G. Alley,Rama Venkatasubramanian +9 more
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TLDR
This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.Abstract:
There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.read more
Citations
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Journal ArticleDOI
Thermoelectric Properties of Substoichiometric Electron Beam Patterned Bismuth Sulfide.
Jose Recatala-Gomez,Jose Recatala-Gomez,Hong Kuan Ng,Hong Kuan Ng,Pawan Kumar,Ady Suwardi,Minrui Zheng,Mohamed Asbahi,Sukant K. Tripathy,Iris Nandhakumar,Mohammad S. M. Saifullah,Kedar Hippalgaonkar,Kedar Hippalgaonkar +12 more
TL;DR: The synthesis, characterization, and direct writing of sub-10 nm wide bismuth sulfide (Bi2S3) is reported using a single source, spin coatable, and electron beam sensitive bismUTH(III) ethylxanthate precursor.
Journal ArticleDOI
Dimensionality effects in high-performance thermoelectric materials: Computational and experimental progress in energy harvesting applications
TL;DR: In this paper, the authors present a review on the new strategies and approaches to achieve high performance thermoelectric materials including materials improvement, structures, and geometry improvement and their applications.
Journal ArticleDOI
Microcontact-Enhanced Thermoelectric Cooling of Ultrahigh Heat Flux Hotspots
TL;DR: In this paper, the thermal and reliability performance of microcontact-enhanced thermoelectric cooling configuration, which uses a contact structure etched directly out of the electronic substrate to concentrate the cooling produced by a commercially available thermocorlectric module, was evaluated using a Laird HV37 thin-film thermocore module with a maximum device level cooling flux of 66 W/cm2.
Proceedings ArticleDOI
Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers
TL;DR: The design and optimization of an on-chip active cooling system based on thin-film thermoelectric coolers (TEC) is explored and a greedy algorithm to determine the deployment of TEC devices and a convex programming based scheme for setting the supply current levels is proposed.
Journal ArticleDOI
Tailoring Electrical Transport Across Metal–Thermoelectric Interfaces Using a Nanomolecular Monolayer
TL;DR: The findings illustrate that molecular nanolayers could be attractive for manipulating interface chemistry and phase formation for tailoring electrical transport across metal-thermoelectric interfaces for solid-state refrigeration applications.
References
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Journal ArticleDOI
Thin-film thermoelectric devices with high room-temperature figures of merit
TL;DR: Th thin-film thermoelectric materials are reported that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys, and the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications.
Journal ArticleDOI
High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys
Bed Poudel,Qing Hao,Yi Ma,Yucheng Lan,Austin J. Minnich,Bo Yu,Xiao Yan,Dezhi Wang,Andrew Muto,Daryoosh Vashaee,Xiaoyuan Chen,Jun-Ming Liu,Mildred S. Dresselhaus,Gang Chen,Zhifeng Ren +14 more
TL;DR: Electrical transport measurements, coupled with microstructure studies and modeling, show that the ZT improvement is the result of low thermal conductivity caused by the increased phonon scattering by grain boundaries and defects, which makes these materials useful for cooling and power generation.
Journal Article
High Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys.
Bed Poudel,Qing Hao,Yi Ma,Austin J. Minnich,Andrew Muto,Yucheng Lan,Bo Yu,Xiao Yan,Dezhi Wang,Daryoosh Vashaee,X.Y. Chen,Dresselhaus,Gang Chen,Zhifeng Ren +13 more
Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
BookDOI
CRC Handbook of Thermoelectrics
TL;DR: In this article, Rowe et al. proposed a method for reducing the thermal conductivity of a thermoelectric generator by reducing the carrier concentration of the generator, which was shown to improve the generator's performance.