Origins of genuine Ohmic van der Waals contact between indium and MoS2
Bum-Kyu Kim,Tae Hyung Kim,Dong-Hwan Choi,Dong-Hwan Choi,Hanul Kim,Kenji Watanabe,Takashi Taniguchi,Heesuk Rho,Ju-Jin Kim,Yong-Hoon Kim,Myung-Ho Bae,Myung-Ho Bae +11 more
- Vol. 5, Iss: 1, pp 1-10
TLDR
In this paper, the authors report the fabrication of ultraclean Ohmic van der Waals (vdW) contacts between indium (In) and molybdenum disulfide (MoS2) and the clarification of the atomistic origins of its Ohmic-like transport properties.Abstract:
The achievement of ultraclean Ohmic van der Waals (vdW) contacts at metal/transition-metal dichalcogenide (TMDC) interfaces would represent a critical step for the development of high-performance electronic and optoelectronic devices based on two-dimensional (2D) semiconductors Herein, we report the fabrication of ultraclean vdW contacts between indium (In) and molybdenum disulfide (MoS2) and the clarification of the atomistic origins of its Ohmic-like transport properties Atomically clean In/MoS2 vdW contacts are achieved by evaporating In with a relatively low thermal energy and subsequently cooling the substrate holder down to ~100 K by liquid nitrogen We reveal that the high-quality In/MoS2 vdW contacts are characterized by a small interfacial charge transfer and the Ohmic-like transport based on the field-emission mechanism over a wide temperature range from 24 to 300 K Accordingly, the contact resistance reaches ~600 Ω μm and ~1000 Ω μm at cryogenic temperatures for the few-layer and monolayer MoS2 cases, respectively Density functional calculations show that the formation of large in-gap states due to the hybridization between In and MoS2 conduction band edge states is the microscopic origins of the Ohmic charge injection We suggest that seeking a mechanism to generate strong density of in-gap states while maintaining the pristine contact geometry with marginal interfacial charge transfer could be a general strategy to simultaneously avoid Fermi-level pinning and minimize contact resistance for 2D vdW materialsread more
Citations
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Journal ArticleDOI
Efficient Ohmic contacts and built-in atomic sublayer protection in MoSi2N4 and WSi2N4 monolayers
Qianqian Wang,Liemao Cao,Shi-Jun Liang,Weikang Wu,Weikang Wu,Guangzhao Wang,Ching Hua Lee,Wee-Liat Ong,Wee-Liat Ong,Hui Ying Yang,Lay Kee Ang,Shengyuan A. Yang,Yee Sin Ang +12 more
TL;DR: In this paper, the authors show that MoSi2N4 and WSiN4 monolayers exhibit strongly suppressed Fermi level pinning effect which reduces the tunability of the Schottky barrier height (SBH) and degrades the performance of 2D semiconductor devices.
Journal ArticleDOI
Fermi Level Pinning Dependent 2D Semiconductor Devices: Challenges and Prospects
TL;DR: In this article , the impact of Fermi level pinning (FLP) on 2D semiconductor devices has been investigated by exploring various origins responsible for the FLP, effects of FLP on two-dimensional device performances, and methods for improving metallic contact to 2D materials.
Journal ArticleDOI
P-type electrical contacts for 2D transition-metal dichalcogenides
Yan Wang,Jong Chan Kim,Youming Li,Kyung Yeol Ma,Seokmo Hong,Minsu Kim,Hyeon Suk Shin,Hu Young Jeong,Manish Chhowalla +8 more
Journal ArticleDOI
Direct Optoelectronic Imaging of 2D Semiconductor-3D Metal Buried Interfaces.
Kiyoung Jo,Pawan Kumar,Joseph Orr,Surendra B. Anantharaman,Jinshui Miao,Michael J. Motala,Arkamita Bandyopadhyay,Kim Kisslinger,Christopher Muratore,Vivek B. Shenoy,Eric A. Stach,Nicholas R. Glavin,Deep Jariwala +12 more
TL;DR: In this article, the authors report the direct measurement of electrical and optical responses of 2D semiconductor-metal buried interfaces using a recently developed metal-assisted transfer technique to expose the buried interface, which is then directly investigated using scanning probe techniques.
Journal ArticleDOI
Enhanced Performance of WS2 Field-Effect Transistor through Mono and Bilayer h-BN Tunneling Contacts.
Nhat Anh Nguyen Phan,Hamin Noh,Ji-Hoon Kim,Yerin Kim,Hanul Kim,Dongmok Whang,Nobuyuki Aoki,Kenji Watanabe,Takashi Taniguchi,Gil-Ho Kim +9 more
TL;DR: In this paper , a strategy to overcome contact resistance and surface contamination by inserting a monolayer of hexagonal boron nitride (h-BN) at the chromium and tungsten disulfide interface is introduced.
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