Phase transformations of silicon caused by contact loading

TLDR: In this paper, the authors combine hardness indentation tests and micro-Raman spectroscopy to show that metallic Si-II is produced near the interface of a diamond indenter and silicon to a depth of about 0.5 μm.

Abstract: Combining hardness indentation tests and micro-Raman spectroscopy it is shown that metallic Si-II is produced near the interface of a diamond indenter and silicon to a depth of about 0.5 μm, where the highest stresses (hydrostatic and deviatoric) exist. At fast unloading rates Si-II transforms to the amorphous state, whereas a mixture of the r8 high pressure polymorph Si-XII and the bc8 phase Si-III forms upon a slow load release. The region of Si-III+Si-XII is surrounded by the wurtzite structured Si-IV, where the stresses during the indentation had not been high enough to cause the transition to the metallic state. Thus, because of shear deformation a direct transformation to Si-IV takes place. Outside the phase-transformed regions the classical aspects of indentation-induced deformation by dislocation glide, twinning and crack formation are observed. Annealing of the high pressure phases leads to the formation of Si-IV at moderate temperatures and to the reversal to the original diamond structure (Si-I...