John H. Magerlein

TL;DR: This study considers multiphysics applications from algorithmic and architectural perspectives, where “algorithmic” includes both mathematical analysis and computational complexity, and “architectural’ includes both software and hardware environments.

TL;DR: In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.

TL;DR: 3D chip technologies come in a number of flavors, but are expected to enable the extension of CMOS performance, which forces the industry to look at formerly-two- dimensional integration issues quite differently, and requires the re-fitting of multiple existing EDA capabilities.

TL;DR: In this article, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, achieving a unit thermal resistance of 10.5 C-mm/sup 2/W from the cooler surface to the inlet water with a fluid pressure drop of less than 35 kPa.

TL;DR: In this article, an integrated microchannel cooler device (or microchannel heat sink device) for cooling IC chips is designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as variable localized cooling capabilities for high power density regions (or hot spots) of IC chips with higher than average power densities.