J
John H. Magerlein
Researcher at IBM
Publications - 51
Citations - 2039
John H. Magerlein is an academic researcher from IBM. The author has contributed to research in topics: Microchannel & Layer (electronics). The author has an hindex of 22, co-authored 51 publications receiving 1935 citations. Previous affiliations of John H. Magerlein include Veeco & GlobalFoundries.
Papers
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Journal ArticleDOI
Multiphysics simulations: Challenges and opportunities
David E. Keyes,Lois Curfman McInnes,Carol S. Woodward,William Gropp,Eric Myra,Michael Pernice,John B. Bell,Jed Brown,Alain Clo,Jeffrey M. Connors,Emil M. Constantinescu,Donald Estep,Katherine J. Evans,Charbel Farhat,Ammar Hakim,Glenn E. Hammond,Glen A. Hansen,Judith Hill,Tobin Isaac,Xiangmin Jiao,Kirk E. Jordan,Dinesh K. Kaushik,Efthimios Kaxiras,Alice Koniges,Kihwan Lee,P. Aaron Lott,Qiming Lu,John H. Magerlein,Reed M. Maxwell,Michael McCourt,Miriam Mehl,Roger P. Pawlowski,Amanda Randles,Daniel R. Reynolds,Béatrice Rivière,Ulrich Rüde,Timothy D. Scheibe,John N. Shadid,Brendan Sheehan,Mark S. Shephard,Andrew R. Siegel,Barry Smith,Xian-Zhu Tang,Cian R. Wilson,Barbara Wohlmuth +44 more
TL;DR: This study considers multiphysics applications from algorithmic and architectural perspectives, where “algorithmic” includes both mathematical analysis and computational complexity, and “architectural’ includes both software and hardware environments.
Journal ArticleDOI
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz,Roger R. Schmidt +14 more
TL;DR: In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.
Proceedings ArticleDOI
Interconnects in the third dimension: design challenges for 3D ICs
Kerry Bernstein,Paul S. Andry,Jerome L. Cann,Phil Emma,David R. Greenberg,Wilfried Haensch,Mike Ignatowski,S.J. Koester,John H. Magerlein,Ruchir Puri,Albert M. Young +10 more
TL;DR: 3D chip technologies come in a number of flavors, but are expected to enable the extension of CMOS performance, which forces the industry to look at formerly-two- dimensional integration issues quite differently, and requires the re-fitting of multiple existing EDA capabilities.
Proceedings ArticleDOI
A practical implementation of silicon microchannel coolers for high power chips
Evan G. Colgan,Bruce K. Furman,A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz +13 more
TL;DR: In this article, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, achieving a unit thermal resistance of 10.5 C-mm/sup 2/W from the cooler surface to the inlet water with a fluid pressure drop of less than 35 kPa.
Patent
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
TL;DR: In this article, an integrated microchannel cooler device (or microchannel heat sink device) for cooling IC chips is designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as variable localized cooling capabilities for high power density regions (or hot spots) of IC chips with higher than average power densities.