抗原变异可使得多种致病微生物易于逃避宿主免疫应答。表达在感染红细胞表面的恶性疟原虫红细胞表面蛋白1（PfPMP1）与感染红细胞、内皮细胞、树突状细胞以及胎盘的单个或多个受体作用，在黏附及免疫逃避中起关键的作用。每个单倍体基因组var基因家族编码约60种成员，通过启动转录不同的var基因变异体为抗原变异提供了分子基础。

疟原虫var基因转换速率变化导致抗原变异[英]／Paul H, Robert P, Christodoulou Z, et al//Proc Natl Acad Sci U S A

Many materials systems are currently under consideration as potential replacements for SiO2 as the gate dielectric material for sub-0.1 μm complementary metal–oxide–semiconductor (CMOS) technology. A systematic consideration of the required properties of gate dielectrics indicates that the key guidelines for selecting an alternative gate dielectric are (a) permittivity, band gap, and band alignment to silicon, (b) thermodynamic stability, (c) film morphology, (d) interface quality, (e) compatibility with the current or expected materials to be used in processing for CMOS devices, (f) process compatibility, and (g) reliability. Many dielectrics appear favorable in some of these areas, but very few materials are promising with respect to all of these guidelines. A review of current work and literature in the area of alternate gate dielectrics is given. Based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success...

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High-κ gate dielectrics: Current status and materials properties considerations

There is a special reason for reviewing this book at this time: it is the 50th edition of a compendium that is known and used frequently in most chemical and physical laboratories in many parts of the world. Surely, a publication that has been published for 56 years, withstanding the vagaries of science in this century, must have had something to offer. There is another reason: while the book is a standard fixture in most chemical and physical laboratories, including those in medical centers, it is not as frequently seen in the laboratories of physician's offices (those either in solo or group practice). I believe that the Handbook can be useful in those laboratories. One of the reasons, among others, is that the various basic items of information it offers may be helpful in new tests, either physical or chemical, which are continuously being published. The basic information may relate

Handbook of Chemistry and Physics

Coinage metals, such as Au, Ag, and Cu, have been important materials throughout history.1 While in ancient cultures they were admired primarily for their ability to reflect light, their applications have become far more sophisticated with our increased understanding and control of the atomic world. Today, these metals are widely used in electronics, catalysis, and as structural materials, but when they are fashioned into structures with nanometer-sized dimensions, they also become enablers for a completely different set of applications that involve light. These new applications go far beyond merely reflecting light, and have renewed our interest in maneuvering the interactions between metals and light in a field known as plasmonics.2–6

In plasmonics, the metal nanostructures can serve as antennas to convert light into localized electric fields (E-fields) or as waveguides to route light to desired locations with nanometer precision. These applications are made possible through a strong interaction between incident light and free electrons in the nanostructures. With a tight control over the nanostructures in terms of size and shape, light can be effectively manipulated and controlled with unprecedented accuracy.3,7 While many new technologies stand to be realized from plasmonics, with notable examples including superlenses,8 invisible cloaks,9 and quantum computing,10,11 conventional technologies like microprocessors and photovoltaic devices could also be made significantly faster and more efficient with the integration of plasmonic nanostructures.12–15 Of the metals, Ag has probably played the most important role in the development of plasmonics, and its unique properties make it well-suited for most of the next-generation plasmonic technologies.16–18

1.1. What is Plasmonics?
Plasmonics is related to the localization, guiding, and manipulation of electromagnetic waves beyond the diffraction limit and down to the nanometer length scale.4,6 The key component of plasmonics is a metal, because it supports surface plasmon polariton modes (indicated as surface plasmons or SPs throughout this review), which are electromagnetic waves coupled to the collective oscillations of free electrons in the metal.

While there are a rich variety of plasmonic metal nanostructures, they can be differentiated based on the plasmonic modes they support: localized surface plasmons (LSPs) or propagating surface plasmons (PSPs).5,19 In LSPs, the time-varying electric field associated with the light (Eo) exerts a force on the gas of negatively charged electrons in the conduction band of the metal and drives them to oscillate collectively. At a certain excitation frequency (w), this oscillation will be in resonance with the incident light, resulting in a strong oscillation of the surface electrons, commonly known as a localized surface plasmon resonance (LSPR) mode.20 This phenomenon is illustrated in Figure 1A. Structures that support LSPRs experience a uniform Eo when excited by light as their dimensions are much smaller than the wavelength of the light.



Figure 1

Schematic illustration of the two types of plasmonic nanostructures discussed in this article as excited by the electric field (Eo) of incident light with wavevector (k). In (A) the nanostructure is smaller than the wavelength of light and the free electrons ...



In contrast, PSPs are supported by structures that have at least one dimension that approaches the excitation wavelength, as shown in Figure 1B.4 In this case, the Eo is not uniform across the structure and other effects must be considered. In such a structure, like a nanowire for example, SPs propagate back and forth between the ends of the structure. This can be described as a Fabry-Perot resonator with resonance condition l=nλsp, where l is the length of the nanowire, n is an integer, and λsp is the wavelength of the PSP mode.21,22 Reflection from the ends of the structure must also be considered, which can change the phase and resonant length. Propagation lengths can be in the tens of micrometers (for nanowires) and the PSP waves can be manipulated by controlling the geometrical parameters of the structure.23

/pdf/controlling-the-synthesis-and-assembly-of-silver-1ktlgomyt6.pdf

Controlling the synthesis and assembly of silver nanostructures for plasmonic applications

The discovery of the enhancement of Raman scattering by molecules adsorbed on nanostructured metal surfaces is a landmark in the history of spectroscopic and analytical techniques. Significant experimental and theoretical effort has been directed toward understanding the surface-enhanced Raman scattering (SERS) effect and demonstrating its potential in various types of ultrasensitive sensing applications in a wide variety of fields. In the 45 years since its discovery, SERS has blossomed into a rich area of research and technology, but additional efforts are still needed before it can be routinely used analytically and in commercial products. In this Review, prominent authors from around the world joined together to summarize the state of the art in understanding and using SERS and to predict what can be expected in the near future in terms of research, applications, and technological development. This Review is dedicated to SERS pioneer and our coauthor, the late Prof. Richard Van Duyne, whom we lost during the preparation of this article.

/pdf/present-and-future-of-surface-enhanced-raman-scattering-34aqgcm385.pdf

Present and Future of Surface-Enhanced Raman Scattering

Dielectrics by atomic layer deposition (ALD) are sought after for fabricating AlGaN/GaN based metal oxide semiconductor heterojunction field effect transistors (MOS-HFETs) for power applications. The ideal gate dielectric is required to suppress gate leakage and minimize threshold voltage (V T) instability by hosting minimal interface traps. Additionally, with the need for an enhancement mode device, it is preferable if it minimizes V T shift in the negative direction. For the first time, we compare popular ALD dielectrics like SiO2, Al2O3, HfO2 and HfAlO with identical electrical thickness on AlGaN/GaN, thereby ensuring identical electrostatic conditions across different dielectrics. High-k ALD dielectrics (HfAlO, HfO2 and Al2O3) are found to suppress gate leakage but host a high density of interface traps with AlGaN, thereby resulting in significant V T instability. ALD SiO2 gate dielectric, annealed in N2 above 600 °C, is a promising gate dielectric candidate which provides the most stable and least negative shift in V T while also substantially suppressing gate leakage below that of an HFET.

https://iopscience.iop.org/article/10.1088/0268-1242/30/12/125017/pdf

ALD gate dielectrics for improved threshold voltage stability in AlGaN/GaN MOS-HFETs for power applications

The performance of 25 nm metallurgical channel length bulk MOSFETs with midgap workfunction metal gates has been compared with conventional polysilicon gates and bandedge workfunction metal gates. Device design using pocket halo implants was implemented to achieve the required off-state leakage specification. Highly accurate, full device simulations have been performed with a linear chain of inverters taking quantum effects into consideration. Drain induced barrier lowering (DIBL) was used as an indicator of short channel effects, and the stage delay of a linear chain of inverters and the on state drive current (I/sub on/) have been identified as metrics for performance. Compared to bandedge metal gates, midgap gates suffer from lower drive currents for both NMOS and PMOS devices. On the other hand, midgap devices were comparable in their performance to N/sup +/ polysilicon gated devices and exceeded that of P/sup +/ polysilicon devices. This high performance was attributed to a lack of poly depletion in midgap metal devices and a higher degree of DIBL which resulted in a lower V/sub t/ under high drain bias providing high drive current. Conclusions have been drawn on the feasibility of using midgap metal gates to simplify process integration in future generation CMOS devices.

A simulation study to evaluate the feasibility of midgap workfunction metal gates in 25 nm bulk CMOS

Thin silicon oxynitride (Si‐O‐N) films have been deposited using low‐pressure rapid thermal chemical vapor deposition (RTCVD) with silane (SiH4), nitrous oxide (N2O), and ammonia (NH3) as the reactive gases. Metal‐oxide‐semiconductor transistor transconductance measurements showed decreasing peak gm values but improved high field degradation characteristics. This is consistent with previous work on thermally nitrided oxides and suggests that the films are perhaps under tensile stress. Hot carrier stress at maximum substrate current was performed with the Si‐O‐N films displaying larger threshold voltage shifts when compared to furnace SiO2 indicating the possible existence of hydrogen related traps.

Thin oxynitride film metal‐oxide‐semiconductor transistors prepared by low‐pressure rapid thermal chemical vapor deposition

Redox-active molecular monolayers were incorporated in MOSFETs to modulate the device characteristics. The discrete molecular states were manifested in the drain current characteristics indicating the presence of distinct energy levels at room temperature.

http://ieeexplore.ieee.org/iel5/9719/30682/01419267.pdf

Modulation of drain current by redox-active molecules incorporated in Si MOSFETs

Characteristics of NiSi and MoSi via full consumption of undoped silicon layers have been studied. Interaction of nickel (Ni) and molybdenum (Mo) silicides with SiO2 was evaluated in terms of work function and thermal stability. For nickel silicide, the work function values were low for samples annealed at 400 °C even after full consumption of silicon. The work function increased with the anneal temperature and stabilized at 600 °C to close to midgap values. Dielectric interaction as a result of silicide formation was studied using current–voltage characteristics. Low leakage currents in these stacks indicated minimum dielectric damage due to silicided gates. Silicidation of Mo was found to be incomplete as the capacitance–voltage curves were marked with larger EOT values and negative shifts in the flatband voltages even at 700 °C. Auger depth profiling, high resolution transmission electron microscopy (HRTEM) and x-ray diffraction (XRD) were used for material analysis of the silicided gate stacks.

Veena Misra

Papers

ALD gate dielectrics for improved threshold voltage stability in AlGaN/GaN MOS-HFETs for power applications

A simulation study to evaluate the feasibility of midgap workfunction metal gates in 25 nm bulk CMOS

Thin oxynitride film metal‐oxide‐semiconductor transistors prepared by low‐pressure rapid thermal chemical vapor deposition

Modulation of drain current by redox-active molecules incorporated in Si MOSFETs

Evaluation of nickel and molybdenum silicides for dual gate complementary metal-oxide semiconductor application