抗原变异可使得多种致病微生物易于逃避宿主免疫应答。表达在感染红细胞表面的恶性疟原虫红细胞表面蛋白1（PfPMP1）与感染红细胞、内皮细胞、树突状细胞以及胎盘的单个或多个受体作用，在黏附及免疫逃避中起关键的作用。每个单倍体基因组var基因家族编码约60种成员，通过启动转录不同的var基因变异体为抗原变异提供了分子基础。

疟原虫var基因转换速率变化导致抗原变异[英]／Paul H, Robert P, Christodoulou Z, et al//Proc Natl Acad Sci U S A

Many materials systems are currently under consideration as potential replacements for SiO2 as the gate dielectric material for sub-0.1 μm complementary metal–oxide–semiconductor (CMOS) technology. A systematic consideration of the required properties of gate dielectrics indicates that the key guidelines for selecting an alternative gate dielectric are (a) permittivity, band gap, and band alignment to silicon, (b) thermodynamic stability, (c) film morphology, (d) interface quality, (e) compatibility with the current or expected materials to be used in processing for CMOS devices, (f) process compatibility, and (g) reliability. Many dielectrics appear favorable in some of these areas, but very few materials are promising with respect to all of these guidelines. A review of current work and literature in the area of alternate gate dielectrics is given. Based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success...

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High-κ gate dielectrics: Current status and materials properties considerations

There is a special reason for reviewing this book at this time: it is the 50th edition of a compendium that is known and used frequently in most chemical and physical laboratories in many parts of the world. Surely, a publication that has been published for 56 years, withstanding the vagaries of science in this century, must have had something to offer. There is another reason: while the book is a standard fixture in most chemical and physical laboratories, including those in medical centers, it is not as frequently seen in the laboratories of physician's offices (those either in solo or group practice). I believe that the Handbook can be useful in those laboratories. One of the reasons, among others, is that the various basic items of information it offers may be helpful in new tests, either physical or chemical, which are continuously being published. The basic information may relate

Handbook of Chemistry and Physics

Coinage metals, such as Au, Ag, and Cu, have been important materials throughout history.1 While in ancient cultures they were admired primarily for their ability to reflect light, their applications have become far more sophisticated with our increased understanding and control of the atomic world. Today, these metals are widely used in electronics, catalysis, and as structural materials, but when they are fashioned into structures with nanometer-sized dimensions, they also become enablers for a completely different set of applications that involve light. These new applications go far beyond merely reflecting light, and have renewed our interest in maneuvering the interactions between metals and light in a field known as plasmonics.2–6

In plasmonics, the metal nanostructures can serve as antennas to convert light into localized electric fields (E-fields) or as waveguides to route light to desired locations with nanometer precision. These applications are made possible through a strong interaction between incident light and free electrons in the nanostructures. With a tight control over the nanostructures in terms of size and shape, light can be effectively manipulated and controlled with unprecedented accuracy.3,7 While many new technologies stand to be realized from plasmonics, with notable examples including superlenses,8 invisible cloaks,9 and quantum computing,10,11 conventional technologies like microprocessors and photovoltaic devices could also be made significantly faster and more efficient with the integration of plasmonic nanostructures.12–15 Of the metals, Ag has probably played the most important role in the development of plasmonics, and its unique properties make it well-suited for most of the next-generation plasmonic technologies.16–18

1.1. What is Plasmonics?
Plasmonics is related to the localization, guiding, and manipulation of electromagnetic waves beyond the diffraction limit and down to the nanometer length scale.4,6 The key component of plasmonics is a metal, because it supports surface plasmon polariton modes (indicated as surface plasmons or SPs throughout this review), which are electromagnetic waves coupled to the collective oscillations of free electrons in the metal.

While there are a rich variety of plasmonic metal nanostructures, they can be differentiated based on the plasmonic modes they support: localized surface plasmons (LSPs) or propagating surface plasmons (PSPs).5,19 In LSPs, the time-varying electric field associated with the light (Eo) exerts a force on the gas of negatively charged electrons in the conduction band of the metal and drives them to oscillate collectively. At a certain excitation frequency (w), this oscillation will be in resonance with the incident light, resulting in a strong oscillation of the surface electrons, commonly known as a localized surface plasmon resonance (LSPR) mode.20 This phenomenon is illustrated in Figure 1A. Structures that support LSPRs experience a uniform Eo when excited by light as their dimensions are much smaller than the wavelength of the light.



Figure 1

Schematic illustration of the two types of plasmonic nanostructures discussed in this article as excited by the electric field (Eo) of incident light with wavevector (k). In (A) the nanostructure is smaller than the wavelength of light and the free electrons ...



In contrast, PSPs are supported by structures that have at least one dimension that approaches the excitation wavelength, as shown in Figure 1B.4 In this case, the Eo is not uniform across the structure and other effects must be considered. In such a structure, like a nanowire for example, SPs propagate back and forth between the ends of the structure. This can be described as a Fabry-Perot resonator with resonance condition l=nλsp, where l is the length of the nanowire, n is an integer, and λsp is the wavelength of the PSP mode.21,22 Reflection from the ends of the structure must also be considered, which can change the phase and resonant length. Propagation lengths can be in the tens of micrometers (for nanowires) and the PSP waves can be manipulated by controlling the geometrical parameters of the structure.23

/pdf/controlling-the-synthesis-and-assembly-of-silver-1ktlgomyt6.pdf

Controlling the synthesis and assembly of silver nanostructures for plasmonic applications

The discovery of the enhancement of Raman scattering by molecules adsorbed on nanostructured metal surfaces is a landmark in the history of spectroscopic and analytical techniques. Significant experimental and theoretical effort has been directed toward understanding the surface-enhanced Raman scattering (SERS) effect and demonstrating its potential in various types of ultrasensitive sensing applications in a wide variety of fields. In the 45 years since its discovery, SERS has blossomed into a rich area of research and technology, but additional efforts are still needed before it can be routinely used analytically and in commercial products. In this Review, prominent authors from around the world joined together to summarize the state of the art in understanding and using SERS and to predict what can be expected in the near future in terms of research, applications, and technological development. This Review is dedicated to SERS pioneer and our coauthor, the late Prof. Richard Van Duyne, whom we lost during the preparation of this article.

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Present and Future of Surface-Enhanced Raman Scattering

Fabrication of large area nano-rings for MRAM application

The high-temperature stability of lanthanum silicate gate dielectric metal-insulator-semiconductor (MIS) devices with either Ta or TaN electrodes has been studied. After a 1000°C, 10 s rapid thermal annealing (RTA) treatment, devices with Ta gate metal undergo an equivalent oxide thickness (EOT) increase from 0.62 to 1.57 nm or higher, while devices with TaN as the gate electrode experience an EOT increase from 0.62 to only 1.12 nm. An EOT less than 1.0 nm is achieved after a 5 s 1000°C RTA, with a corresponding gate leakage of 0.1 A/cm 2 . Medium-energy ion scattering and X-ray diffraction (XRD) analysis reveal that the Ta gate metal undergoes a phase change due to reaction with N 2 above 800°C, while for TaN no change in the XRD spectrum is detected. Interface state defect densities and leakage currents are reduced after the high-temperature processing. Results reveal the importance of the entire gate stack design and processing in obtaining good device properties.

High-Temperature Stability of Lanthanum Silicate Gate Dielectric MIS Devices with Ta and TaN Electrodes

Halo implants with various tilt angles and energies were compared from the point of hot carrier reliability. Our study shows that a larger tilt or a deeper, more energetic halo implant leads to stronger reverse short channel effects and higher electric field in the extension/channel junction. However, the net impact of a sharper extension/channel junction on hot carrier degradation was found to be minimal, because the weaker halo devices have higher substrate current resulting from higher drain currents which counterbalances increased electric field in the extension-channel junction for the stronger halo devices. However, when devices from two lots with similar performance parametrics, such as similar threshold voltage (V/sub t/) roll-off, were compared, larger tilt/lower energy halo devices were found to have less degradation than lower tilt/higher energy halos.

Effects of halo implant on hot carrier reliability of sub-quarter micron MOSFETs

A spin wave Doppler technique is used to measure the spin transfer velocity and the current polarization in current-carrying (Ni0.80Fe0.20)1−xGdx alloy wires. Reduced magnetization values with Gd doping suggest possible increases in the spin transfer velocity. Contrary to these expectations, we measured a decrease in the spin transfer velocity upon introducing Gd dopants. For a current density of 1011 A/m2, the measured velocities range from 6.0 m/s ± 0.6 m/s for pure Permalloy (Ni0.80Fe0.20) to 2.6 m/s ± 0.3 m/s for (Ni0.80Fe0.20)0.945Gd0.055. Interpretation of these values yields a current polarization ranging from 0.71 ± 0.02 to 0.30 ± 0.01 for the same compositions. These results reveal that Gd dopants in Permalloy have a more significant impact on the current polarization than on the material’s magnetization for these alloy compositions.

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Impact of Gd dopants on current polarization and the resulting effect on spin transfer velocity in Permalloy wires

This paper describes an in situ boron‐doped, multilayer epitaxial silicon process that can be used to obtain doping profiles for channels in the deep‐submicron regime. We have extensively studied lightly doped channel structures in which an intrinsic silicon layer is grown on an in situ doped epitaxial silicon film. Low‐thermal‐budget processing is achieved by the ultrahigh‐vacuum rapid thermal chemical vapor deposition technique which combines low‐temperature surface preparation and deposition (≤800°C) while providing high growth rates using disilane . Boron doping is achieved using diborane diluted in hydrogen (500 ppm) as the precursor. Temperature and gas switching are compared in terms of doping transition, interface contamination (carbon and oxygen incorporation), and impurity diffusion upon annealing. Our results reveal that for a contamination‐free epitaxial silicon interface, interfacial carbon contamination must be eliminated or reduced to a minimum level. Using this process, short‐channel n‐channel metal‐oxide semiconductor devices μm) have been fabricated for the first time demonstrating the potential use of the technique. It was found that lightly doped channel metal‐oxide semiconductor field effect transistors are more easily scalable into the 0.1 μm regime with superior short‐channel characteristics. © 1999 The Electrochemical Society. All rights reserved.

Veena Misra

Papers

Fabrication of large area nano-rings for MRAM application

High-Temperature Stability of Lanthanum Silicate Gate Dielectric MIS Devices with Ta and TaN Electrodes

Effects of halo implant on hot carrier reliability of sub-quarter micron MOSFETs

Impact of Gd dopants on current polarization and the resulting effect on spin transfer velocity in Permalloy wires

A Low‐Thermal‐Budget In Situ Doped Multilayer Silicon Epitaxy Process for MOSFET Channel Engineering