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Veena Misra

Researcher at North Carolina State University

Publications -  251
Citations -  5283

Veena Misra is an academic researcher from North Carolina State University. The author has contributed to research in topics: Gate dielectric & Dielectric. The author has an hindex of 39, co-authored 249 publications receiving 4954 citations. Previous affiliations of Veena Misra include University of North Carolina at Chapel Hill & Motorola.

Papers
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Electrical Characteristics of TaSi,N,, Gate Electrodes For Dual Gate Si-CMOS Devices

TL;DR: In this article, the physical and electrical properties of TaSi,N, films are evaluated for gate electrode applications, and the results indicate that the workfunction of the films is compatible with NMOS devices.
Journal ArticleDOI

Electrical Characteristics of SiO 2 Deposited by Atomic Layer Deposition on 4H–SiC After Nitrous Oxide Anneal

TL;DR: In this article, the properties of SiO2 gate dielectric deposited by atomic layer deposition (ALD) on Si-face of 4H silicon carbide (SiC) were systematically studied.
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Investigation of the Origin of $V_{T}/V_{\rm FB}$ Modulation by $\hbox{La}_{2}\hbox{O}_{3}$ Capping Layer Approaches for NMOS Application: Role of La Diffusion, Effect of Host High- $k$ Layer, and Interface Properties

TL;DR: The role of La2O3 capping in the VT/VFB shift with various high-k and metal gate electrodes was systematically investigated in this paper, where a 400mV shift in VT from the control HfO2 device with minimal degradation in mobility was obtained when a La 2O3 layer was inserted between the high k and SiO2 layers.
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Redox-active monolayers on nano-scale silicon electrodes.

TL;DR: Uniform arrays of nano-scale electrolyte-molecule-silicon capacitors have been successfully fabricated by a combination of reactive ion etch and a selective wet etch through an anodic aluminium oxide mask to form nano-holes in silicon oxide/silicon nitride insulator layers on silicon.
Patent

Crossbar array microelectronic electrochemical cells and fabrication methods therefor

TL;DR: In this paper, a composite microelectronic structure is provided that includes first and second conductors dielectrically isolated from one another at a crossing thereof, the crossing surrounded by a dielectric material.