Journal ArticleDOI
A Silicon 60-GHz Receiver and Transmitter Chipset for Broadband Communications
Scott K. Reynolds,Brian Floyd,Ullrich R. Pfeiffer,Troy J. Beukema,Janusz Grzyb,C. Haymes,Brian P. Gaucher,Mehmet Soyuer +7 more
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TLDR
A 0.13-mum SiGe BiCMOS double-conversion superheterodyne receiver and transmitter chipset for data communications in the 60-GHz band is presented.Abstract:
A 0.13-mum SiGe BiCMOS double-conversion superheterodyne receiver and transmitter chipset for data communications in the 60-GHz band is presented. The receiver chip includes an image-reject low-noise amplifier (LNA), RF-to-IF mixer, IF amplifier strip, quadrature IF-to-baseband mixers, phase-locked loop (PLL), and frequency tripler. It achieves a 6-dB noise figure, -30 dBm IIP3, and consumes 500 mW. The transmitter chip includes a power amplifier, image-reject driver, IF-to-RF upmixer, IF amplifier strip, quadrature baseband-to-IF mixers, PLL, and frequency tripler. It achieves output P1dB of 10 to 12dBm, Psat of 15 to 17 dBm, and consumes 800 mW. The chips have been packaged with planar antennas, and a wireless data link at 630 Mb/s over 10 m has been demonstratedread more
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Journal ArticleDOI
Review of terahertz and subterahertz wireless communications
John F. Federici,Lothar Moeller +1 more
TL;DR: The goal of this paper is to provide a comprehensive review of wireless sub-THz and THz communications and report on the reported advantages and challenges of using sub-terahertz andTHz waves as a means to transmit data wirelessly.
Journal ArticleDOI
State of the Art in 60-GHz Integrated Circuits and Systems for Wireless Communications
TL;DR: An overview of the technological advances in millimeter-wave circuit components, antennas, and propagation that will soon allow 60-GHz transceivers to provide multigigabit per second (multi-Gb/s) wireless communication data transfers in the consumer marketplace is presented.
Journal ArticleDOI
60 GHz wireless communications: emerging requirements and design recommendations
TL;DR: This paper details design tradeoffs for algorithms in the 60 GHz physical layer including modulation, equalization, and space-time processing and considers the limitations in circuit design, characteristics of the effective wireless channel, and performance requirements to support current and next generation 60 GHz wireless communication applications.
Journal ArticleDOI
Beamforming for Millimeter Wave Communications: An Inclusive Survey
Shajahan Kutty,Debarati Sen +1 more
TL;DR: The suitability of millimeter wave beamforming methods, both, existing and proposed till midyear 2015, are explored, and the exciting new prospects unfolding in this domain are identified.
Journal ArticleDOI
Indoor Office Wideband Millimeter-Wave Propagation Measurements and Channel Models at 28 and 73 GHz for Ultra-Dense 5G Wireless Networks
TL;DR: The results show that novel large-scale path loss models provided here are simpler and more physically based compared to previous 3GPP and ITU indoor propagation models that require more model parameters and offer very little additional accuracy and lack a physical basis.
References
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Journal ArticleDOI
Millimeter-wave CMOS design
TL;DR: In this paper, the effects of parasitics on the high-frequency performance of 130-nm CMOS transistors are investigated, and a peak f/sub max/ of 135 GHz has been achieved with optimal device layout.
Journal ArticleDOI
SiGe bipolar transceiver circuits operating at 60 GHz
Brian Floyd,Scott K. Reynolds,Ullrich R. Pfeiffer,Thomas Zwick,Troy J. Beukema,Brian P. Gaucher +5 more
TL;DR: In this paper, a low-noise amplifier, direct-conversion quadrature mixer, power amplifier, and voltage-controlled oscillators have been implemented in a 1.2/spl mu/m, 200-GHz, T/290-GHz f/sub MAX/SiGe bipolar technology for operation at 60 GHz.
Journal ArticleDOI
A 77-GHz Phased-Array Transceiver With On-Chip Antennas in Silicon: Transmitter and Local LO-Path Phase Shifting
TL;DR: In this article, the first fully integrated 77-GHz phased-array transceiver is presented, which utilizes a local LO-path phase-shifting architecture to achieve beam steering and includes four transmit and receive elements, along with the LO frequency generation and distribution circuitry.
Proceedings ArticleDOI
A silicon 60GHz receiver and transmitter chipset for broadband communications
TL;DR: An integrated SiGe superheterodyne RX/TX pair capable of Gb/s data rates in the 60GHz band is described and achieves 10% PAE in the final stage.
Journal ArticleDOI
A chip-scale packaging technology for 60-GHz wireless chipsets
Ullrich R. Pfeiffer,Janusz Grzyb,Duixian Liu,Brian P. Gaucher,Troy J. Beukema,Brian Floyd,Scott K. Reynolds +6 more
TL;DR: In this article, a cost-effective chip-scale packaging solution for a 60GHz industrial-scientific-medical band receiver (Rx) and transmitter (Tx) chipset capable of gigabit-per-second wireless communications is presented.