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Journal ArticleDOI

Covalently formation of insulation and barrier layers in high aspect ratio TSVs

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TLDR
In this paper, a cost-effective and highly reliable wet deposition path was proposed to fabricate polyacrylic acid (PAA) insulation films and nickel diffusion barriers on the silicon substrate.
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This article is published in Applied Surface Science.The article was published on 2022-01-30. It has received 7 citations till now. The article focuses on the topics: Silicon & Substrate (aquarium).

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Proceedings ArticleDOI

Approaches for a Solely Electroless Metallization of Through-Glass Vias

TL;DR: In this article , a self-assembling monolayers of (3-mercap-topropyl) trimethoxysilane (MPTMS), a photocatalytic layer of titanium tetraisopropoxide (TTiP), and a sol-gel process were used to fill through-glass Vias.
Journal ArticleDOI

Electro-polymerization rates of diazonium salts are dependent on the crystal orientation of the surface.

TL;DR: In this article , the authors report the electrochemical reduction of diazonium salts on a range of silicon electrodes of different crystal orientations (111, 211, 311, 411, and 100) and show that the kinetics of surface reaction and the reduction potential is Si crystal-facet dependent and is more favorable in the hierarchical order.
Journal ArticleDOI

Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study

TL;DR: In this paper , the effects of capped Cu layer on the protrusion behaviors of TSV-Cu are investigated considering various double annealing processes and nanoindentation test.
Journal ArticleDOI

Holding time effect on mechanical properties and protrusion behaviors of through silicon via copper under various annealing processes

TL;DR: In this article , the authors obtained the stress-strain constitutive curves of TSV-Cu under various annealing conditions considering holding time effect by the nanoindentation test and finite element reverse analysis.
Journal ArticleDOI

Electrochemical Grafting of an Aminated Poly(methyl methacrylate) (PMMA)-like Liner onto a Silicon Surface for the Metallization of Microfeatures

TL;DR: In this paper , a diazonium-based electrochemical process was proposed to graft an aminated poly(methyl methacrylate) (PMMA) liner onto Si microfeatures with high step-coverage.
References
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Journal ArticleDOI

Covalent modification of iron surfaces by electrochemical reduction of aryldiazonium salts.

TL;DR: It is shown that the attachment of the aryl groups is to an iron and not to an oxygen atom and that the bond is covalent.
Journal ArticleDOI

An overview of through-silicon-via technology and manufacturing challenges

TL;DR: A comprehensive overview of through-silicon-via technology (TSV) is presented, including etch, insulation, and metallization, along with the backside processing, assembly, metrology, design, packaging, reliability, testing and yield challenges that arise with the use of TSVs.
Journal ArticleDOI

The fabrication of stable gold nanoparticle-modified interfaces for electrochemistry.

TL;DR: T tethering AuNPs to glassy carbon (GC) surfaces using surface bound diazonium salts is investigated as a strategy to produce stable gold nanoparticle (AuNP) surfaces.
Journal ArticleDOI

Fe2P as a novel efficient catalyst promoter in Pd/C system for formic acid electro-oxidation in fuel cells reaction

TL;DR: In this paper, Fe2P was used as an efficient catalyst promoter in Pd/C catalyst system for formic acid electro-oxidation in fuel cells reactions. But the performance of the Pd-Fe2P/C system was not analyzed.
Journal ArticleDOI

XPS studies of nitrogen-containing conjugated polymers–palladium systems

TL;DR: In this article, it is shown that the differences in the redox and basic properties of PANI and polypyrrole doped with chloride ions lead to different mechanisms of their interactions with palladium ions present in the PdCl 2 solutions studied.
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