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Mechanics of rollable and foldable film-on-foil electronics

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TLDR
In this article, the mechanics of film-on-foil transistors on steel and plastic foils have been discussed in the context of thin-film transistors, where the transistors function well after the foils are rolled to small radii of curvature.
Abstract
The mechanics of film-on-foil devices is presented in the context of thin-film transistors on steel and plastic foils Provided the substrates are thin, such transistors function well after the foils are rolled to small radii of curvature When a substrate with a lower elastic modulus is used, smaller radii of curvature can be achieved Furthermore, when the transistors are placed in the neutral surface by sandwiching between a substrate and an encapsulation layer, even smaller radii of curvature can be attained Transistor failure clearly shows when externally forced and thermally induced strains add to, or subtract from, each other

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Citations
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Journal ArticleDOI

Flexible a-Si:H-based Image Sensors Fabricated by Digital Lithography

TL;DR: Amorphous silicon-based x-ray image sensor arrays were fabricated on poly-ethylene naphthalate substrates at process temperatures below 180°C Patterning of the thinfilm transistor backplane was accomplished using ink-jet printed etch masks.
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Flexibility of Low Temperature Polycrystalline Silicon Thin-Film Transistor on Tungsten Foil

TL;DR: In this article, the p-channel TFTs on tungsten foil, using the poly-Si obtained by metal induced crystallization, exhibited a field effect mobility of 88.8 cm2 V-1 s-1, threshold voltage of -4.8 V, subthreshold swing of 0.64 V/decade, and a minimum off current of <10-12 A/µm.
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Thin-film semiconductors—From exploration to application

TL;DR: A grounding in thin-film science and technology, an interest in combining materials science with applied physics and electrical engineering, and the active pursuit of collaborations with experts in other disciplines is reviewed in this paper.
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Mechano‐Graded Electrodes Mitigate the Mismatch between Mechanical Reliability and Energy Density for Foldable Lithium‐Ion Batteries

TL;DR: Li et al. as mentioned in this paper proposed mechano-graded electrodes with gradient-distributed maximum allowable strain to endow highloading mass slurry-coating electrodes with brilliant intrinsic flexibility without sacrificing energy density.
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Wafer-Level Vacuum-Packaged Flexible and Bendable Micro Accelerometer

TL;DR: In this paper, a wafer-level vacuum-packaged z-axis capacitive micro accelerometer fabricated on a flexible polyimide substrate and encapsulated by another polyimides superstrate enabling the flexibility, bendability, and portability of both the device and the package.
References
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Journal ArticleDOI

Large deformation and geometric instability of substrates with thin-film deposits

TL;DR: In this paper, experimental and theoretical results are presented on the evolution of large elastic deformation, non-uniform curvature, shape changes and geometric instability in substrates of Si wafers with metal films.
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Some elementary connections between curvature and mismatch strain in compositionally graded thin films

TL;DR: In this paper, the relationship of the overall curvature of the film to the variation of properties and mismatch strain is reviewed, and it is shown that the mismatch strain distribution in the film can be expressed in terms of the dependence of curvature on film thickness.
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a-Si:H TFTs made on polyimide foil by PE-CVD at 150 °C

TL;DR: In this paper, high performance amorphous silicon thin-film transistors (a-Si:H TFTs) were fabricated on 2 mil. (51 µm) thick polyimide foil substrates.
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Elastic Bending of Semiconductor Wafer Revisited and Comments on Stoney's Equation

TL;DR: In this article, the authors re-examine the Stoney's equation and point out that it was derived based on a neutral axis for zero bending moment which does not exist in the pure bending of a steel ruler on which his derivation was based.
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a-Si:H Thin-Film Transistors on Rollable 25-µ;m Thick Steel Foil

TL;DR: In this article, the first amorphous silicon thin film transistors (TFTs) were fabricated on flexible, ultra-thin substrates of 25 µm thick stainless steel foil.
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