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Mechanics of rollable and foldable film-on-foil electronics

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TLDR
In this article, the mechanics of film-on-foil transistors on steel and plastic foils have been discussed in the context of thin-film transistors, where the transistors function well after the foils are rolled to small radii of curvature.
Abstract
The mechanics of film-on-foil devices is presented in the context of thin-film transistors on steel and plastic foils Provided the substrates are thin, such transistors function well after the foils are rolled to small radii of curvature When a substrate with a lower elastic modulus is used, smaller radii of curvature can be achieved Furthermore, when the transistors are placed in the neutral surface by sandwiching between a substrate and an encapsulation layer, even smaller radii of curvature can be attained Transistor failure clearly shows when externally forced and thermally induced strains add to, or subtract from, each other

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Citations
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Journal ArticleDOI

Functional integrity of flexible n-channel metal–oxide–semiconductor field-effect transistors on a reversibly bistable platform

TL;DR: In this paper, the effects of cumulative impulsive force loading on thinned (25 μm) flexible silicon-based n-channel metal-oxide-semiconductor field effect transistor devices housed on a reversibly bistable flexible platform were investigated.
Journal ArticleDOI

Flexible substrate and release layer for flexible MEMS devices

TL;DR: In this article, a flexible substrate fabrication on silicon carrier wafers and subsequent release of the flexible substrate from the carrier wafer is described, which utilizes the low adhesion strength, high glass transition temperature (360°C) HD Microsystems PI2611 as the release layer.

Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

TL;DR: In this article, the failure mechanisms of flexible printed devices are analyzed by correlating their electrical or structural properties with applied strain, supported by detailed micro-structural investigations, and the authors propose a failure mechanism analysis method to understand their failure mechanisms.
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Cyclic Bending Reliability of Silk Screen Printed Silver Traces on Plastic and Paper Substrates

TL;DR: In this paper, the effect of the substrate on the cyclic bending reliability of screen printed silver traces is studied, and the results showed that the reliability of the traces was highly dependent on the substrate thickness in all the studied materials.
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P-28: The Effect of Thermal Shrinkage on Indium Tin Oxide Coated Polyethylene Terephthalate for Flexible Display Applications

TL;DR: In this paper, the shrinkage of Indium Tin Oxide (ITO) coated Polyethylene Terephthalate (PET) for flexible display applications was investigated using a Thermal Mechanical Analyzer (TMA).
References
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Journal ArticleDOI

Large deformation and geometric instability of substrates with thin-film deposits

TL;DR: In this paper, experimental and theoretical results are presented on the evolution of large elastic deformation, non-uniform curvature, shape changes and geometric instability in substrates of Si wafers with metal films.
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Some elementary connections between curvature and mismatch strain in compositionally graded thin films

TL;DR: In this paper, the relationship of the overall curvature of the film to the variation of properties and mismatch strain is reviewed, and it is shown that the mismatch strain distribution in the film can be expressed in terms of the dependence of curvature on film thickness.
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a-Si:H TFTs made on polyimide foil by PE-CVD at 150 °C

TL;DR: In this paper, high performance amorphous silicon thin-film transistors (a-Si:H TFTs) were fabricated on 2 mil. (51 µm) thick polyimide foil substrates.
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Elastic Bending of Semiconductor Wafer Revisited and Comments on Stoney's Equation

TL;DR: In this article, the authors re-examine the Stoney's equation and point out that it was derived based on a neutral axis for zero bending moment which does not exist in the pure bending of a steel ruler on which his derivation was based.
Journal ArticleDOI

a-Si:H Thin-Film Transistors on Rollable 25-µ;m Thick Steel Foil

TL;DR: In this article, the first amorphous silicon thin film transistors (TFTs) were fabricated on flexible, ultra-thin substrates of 25 µm thick stainless steel foil.
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