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Nucleation-controlled gold-induced-crystallization for selective formation of Ge(100) and (111) on insulator at low-temperature (∼250 °C)

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TLDR
In this paper, the formation of Ge(100) and (111) on amorphous-insulator at low-temperatures (∼250 °C) is realized through gold-induced-crystallization using a-Ge/Au/SiO2 stacked-structures by combining interface-energy-modulation of substrates.
Abstract
Selective formation of Ge(100) and (111) on amorphous-insulator at low-temperatures (∼250 °C) is realized through gold-induced-crystallization using a-Ge/Au/SiO2 stacked-structures by combining interface-energy-modulation of substrates. Introduction of thin-Al2O3 layers (∼7 nm thickness) at a-Ge/Au interfaces enables large-grain (≥20 μm) Ge(111) formation, which is speculated to be due to suppression of random bulk-nucleation and domination of (111)-oriented interface-nucleation on SiO2. To examine this speculation, Al2O3-covered substrates are employed. This results in formation of Ge(100), due to energetically favorable (100)-oriented interface-nucleation on Al2O3. Consequently, large-grain (≥20 μm) Ge(100) and (111) are achieved on amorphous-insulators at 250 °C. This technique is very useful to realize flexible-electronics.

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Citations
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Journal ArticleDOI

Growth and applications of GeSn-related group-IV semiconductor materials

TL;DR: In this paper, a review of the technology of Ge1−xSnx-related group-IV semiconductor materials for developing Si-based nanoelectronics is presented.
Journal ArticleDOI

Low-temperature (180 °C) formation of large-grained Ge (111) thin film on insulator using accelerated metal-induced crystallization

TL;DR: In this article, the Al-induced crystallization (AIC) yields a large-grained (111)-oriented Ge thin film on an insulator at temperatures as low as 180°C.
Journal ArticleDOI

High carrier mobility in orientation-controlled large-grain (≥50 μm) Ge directly formed on flexible plastic by nucleation-controlled gold-induced-crystallization

TL;DR: In this article, the electrical properties of orientation-controlled large-grain gold-induced-crystallization (GIC) crystals on flexible-plastic directly formed by nucleation-controlled Gold-Induced Crystallization was examined.
Journal ArticleDOI

Metal-induced layer exchange of group IV materials

TL;DR: A great deal of effort has been put into research on the mechanism and applications of layer exchange, which has allowed various group IV materials (Si, SiGe, Ge, GeSn and C) to form on arbitrary substrates using appropriate metal catalysts.
References
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Journal ArticleDOI

Surface Energy of Germanium and Silicon

TL;DR: In this article, a direct measurement of specific surface energy of Ge and Si made by the cleavage technique was made by measuring the force just necessary to move a crack "in reversible fashion".
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Silicide formation and silicide‐mediated crystallization of nickel‐implanted amorphous silicon thin films

TL;DR: In this paper, the nucleation and growth of isolated nickel disilicide precipitates in amorphous Si thin films and the subsequent low-temperature silicide-mediated crystallization of Si was studied using in situ transmission electron microscopy.
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Elucidation of the layer exchange mechanism in the formation of polycrystalline silicon by aluminum-induced crystallization

TL;DR: Aluminum-induced crystallization of amorphous silicon is studied as a promising low-temperature alternative to solid-phase and laser crystallization in this article, where the overall process of the Al and Si layer exchange during annealing at temperatures below the eutectic temperature of 577 °C is investigated by various microscopy techniques.
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(GaMn)As: GaAs-based III–V diluted magnetic semiconductors grown by molecular beam epitaxy

TL;DR: In this article, a III-V diluted magnetic semiconductors (Ga 1-x Mn x )As were grown on GaAs substrates by low-temperature molecular beam epitaxy using strong nonequilibrium growth conditions.
Journal ArticleDOI

In-situ X-ray Diffraction study of Metal Induced Crystallization of amorphous silicon

TL;DR: In this paper, in-situ X-ray Diffraction was used to study the MIC process for 20 different metals (Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Al and Ag).
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