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Journal ArticleDOI

Processing and Prolonged 500 C Testing of 4H-SiC JFET Integrated Circuits with Two Levels of Metal Interconnect

TLDR
In this article, the authors report the processing and testing of 4H-SiC junction field effect transistor (JFET) prototype IC's with two levels of metal interconnect capable of prolonged operation at 500 C.
Abstract
Complex integrated circuit (IC) chips rely on more than one level of interconnect metallization for routing of electrical power and signals. This work reports the processing and testing of 4H-SiC junction field effect transistor (JFET) prototype IC's with two levels of metal interconnect capable of prolonged operation at 500 C. Packaged functional circuits including 3- and 11-stage ring oscillators, a 4-bit digital to analog converter, and a 4-bit address decoder and random access memory cell have been demonstrated at 500 C. A 3-stage oscillator functioned for over 3000 hours at 500 C in air ambient. Improved reproducibility remains to be accomplished.

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Journal ArticleDOI

Demonstration of 4H-SiC Digital Integrated Circuits Above 800 °C

TL;DR: In this paper, short-term demonstrations of packaged 4H-SiC junction field effect transistor (JFET) logic integrated circuits (ICs) at temperatures exceeding 800 °C in air are reported, including a 26-transistor 11-stage ring oscillator that functioned at 961 °C ambient temperature.
Journal ArticleDOI

Prolonged 500 °C Demonstration of 4H-SiC JFET ICs With Two-Level Interconnect

TL;DR: In this paper, fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 h of stable electrical operation at 500 °C in air ambient.
Journal ArticleDOI

Operational Testing of 4H-SiC JFET ICs for 60 Days Directly Exposed to Venus Surface Atmospheric Conditions

TL;DR: In this paper, the authors report a successful two-month (60-day) operational demonstration of two 175-transistor 4H-SiC junction field effect transistor (JFET) integrated circuits directly exposed (no cooling and no protective chip packaging) to high-fidelity physical and chemical reproduction of Venus surface atmospheric conditions in a test chamber.
Journal ArticleDOI

High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application

TL;DR: In this paper, the results of elevated temperature testing (as high as 500°C) for extended periods (up to 100 hours) of several building block circuits were presented, created using the Raytheon UK's HiTSiC® CMOS process, present the densest, lowest power integrated circuit technology capable of operating at these extreme temperatures for any period of time.
Journal ArticleDOI

Yearlong 500 °C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits

TL;DR: In this paper, the first stable electrical operation of semiconductor ICs for 1 year (8760 hours) at 500°C in air atmosphere was reported, achieving a more than 7-fold increase in circuit complexity from the 24 transistor ring oscillator ICs reported at HiTEC 2016.
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