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Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process

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TLDR
In this paper, the surface chemistry of the trimethylaluminum/water ALD process is reviewed, with an aim to combine the information obtained in different types of investigations, such as growth experiments on flat substrates and reaction chemistry investigation on high-surface-area materials.
Abstract
Atomic layer deposition(ALD), a chemical vapor deposition technique based on sequential self-terminating gas–solid reactions, has for about four decades been applied for manufacturing conformal inorganic material layers with thickness down to the nanometer range. Despite the numerous successful applications of material growth by ALD, many physicochemical processes that control ALD growth are not yet sufficiently understood. To increase understanding of ALD processes, overviews are needed not only of the existing ALD processes and their applications, but also of the knowledge of the surface chemistry of specific ALD processes. This work aims to start the overviews on specific ALD processes by reviewing the experimental information available on the surface chemistry of the trimethylaluminum/water process. This process is generally known as a rather ideal ALD process, and plenty of information is available on its surface chemistry. This in-depth summary of the surface chemistry of one representative ALD process aims also to provide a view on the current status of understanding the surface chemistry of ALD, in general. The review starts by describing the basic characteristics of ALD, discussing the history of ALD—including the question who made the first ALD experiments—and giving an overview of the two-reactant ALD processes investigated to date. Second, the basic concepts related to the surface chemistry of ALD are described from a generic viewpoint applicable to all ALD processes based on compound reactants. This description includes physicochemical requirements for self-terminating reactions,reaction kinetics, typical chemisorption mechanisms, factors causing saturation, reasons for growth of less than a monolayer per cycle, effect of the temperature and number of cycles on the growth per cycle (GPC), and the growth mode. A comparison is made of three models available for estimating the sterically allowed value of GPC in ALD. Third, the experimental information on the surface chemistry in the trimethylaluminum/water ALD process are reviewed using the concepts developed in the second part of this review. The results are reviewed critically, with an aim to combine the information obtained in different types of investigations, such as growth experiments on flat substrates and reaction chemistry investigation on high-surface-area materials. Although the surface chemistry of the trimethylaluminum/water ALD process is rather well understood, systematic investigations of the reaction kinetics and the growth mode on different substrates are still missing. The last part of the review is devoted to discussing issues which may hamper surface chemistry investigations of ALD, such as problematic historical assumptions, nonstandard terminology, and the effect of experimental conditions on the surface chemistry of ALD. I hope that this review can help the newcomer get acquainted with the exciting and challenging field of surface chemistry of ALD and can serve as a useful guide for the specialist towards the fifth decade of ALD research.

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Citations
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High dielectric constant gate oxides for metal oxide Si transistors

TL;DR: In this article, a review of the development of high-k gate oxides such as hafnium oxide (HFO) and high-K oxides is presented, with the focus on the work function control in metal gate electrodes.
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Platinum single-atom and cluster catalysis of the hydrogen evolution reaction

TL;DR: A practical synthesis method to produce isolated single platinum atoms and clusters using the atomic layer deposition technique and indicates that the partially unoccupied density of states of the platinum atoms' 5d orbitals on the nitrogen-doped graphene are responsible for the excellent performance.
Journal ArticleDOI

A brief review of atomic layer deposition: from fundamentals to applications

TL;DR: Atomic layer deposition (ALD) is a vapor phase technique capable of producing thin films of a variety of materials as discussed by the authors, including metal oxides such as Zn1−xSnxOy, ZrO2, Y2O3, and Pt.
Journal ArticleDOI

Crystallinity of inorganic films grown by atomic layer deposition: Overview and general trends

TL;DR: Puurunen et al. as discussed by the authors summarized the two-reactant ALD processes to grow inorganic materials developed to-date, updating the information of an earlier review on ALD.
References
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Journal ArticleDOI

Growth and characterization of aluminium oxide thin films deposited from various source materials by atomic layer epitaxy and chemical vapor deposition processes

TL;DR: In this article, thin aluminium oxide thin films were prepared by the ALE process using AICI3 and A1(OR)3 (R = Et,Pr) as aluminium source and H2O, O2 or various aliphatic alcohols as oxygen source.
Journal ArticleDOI

Atomic layer growth of TiO2 on silica

TL;DR: In this paper, the effects of the number and types of surface bonding sites and reaction temperature on the growth rate and structure of TiO2 were determined, and XRD peaks at the 2θ values of anatase and rutile were detected after one reaction cycle of TiCl4 and H2O at 450°C.
Journal ArticleDOI

Growth Per Cycle in Atomic Layer Deposition: Real Application Examplesof a Theoretical Model

TL;DR: In this paper, a theoretical model was derived to describe the growth per cycle in atomic layer deposition (ALD) as a function of the chemistry of the growth when compounds are used as reactants.
Journal ArticleDOI

CD-free Cu(In,Ga)Se2 thin-film solar modules with In2S3 buffer layer by ALCVD

TL;DR: In this paper, the atomic layer chemical vapour deposition (ALCVD) technique was used for the deposition of highly homogeneous thin-films with an excellent step coverage.
Journal ArticleDOI

Characteristics of copper films produced via atomic layer deposition

TL;DR: In this paper, the atomic layer deposition (ALD) was used to produce copper films with properties of composition, morphology, and electrical properties of these films grown on glass, as well as Ta, TiN, and TaN on silicon wafers.
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