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Boris Hudec

Researcher at National Chiao Tung University

Publications -  51
Citations -  2117

Boris Hudec is an academic researcher from National Chiao Tung University. The author has contributed to research in topics: Atomic layer deposition & Electrode. The author has an hindex of 16, co-authored 45 publications receiving 1341 citations. Previous affiliations of Boris Hudec include Slovak Academy of Sciences.

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SLIM: Simultaneous Logic-in-Memory Computing Exploiting Bilayer Analog OxRAM Devices.

TL;DR: This paper proposes a novel ‘Simultaneous Logic in-Memory’ (SLIM) methodology which is complementary to existing LIM approaches in literature and demonstrates novel SLIM bitcells comprising non-filamentary bilayer analog OxRAM devices with NMOS transistors.
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Recommended Methods to Study Resistive Switching Devices

TL;DR: This manuscript describes the most recommendable methodologies for the fabrication, characterization, and simulation of RS devices, as well as the proper methods to display the data obtained.
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SLIM: Simultaneous Logic-in-Memory Computing Exploiting Bilayer Analog OxRAM Devices

TL;DR: In this paper, the authors proposed a novel "simultaneous logic in-memory" (SLIM) methodology that allows to implement both memory and logic operations simultaneously on the same bitcell in a non-destructive manner without losing the previously stored Memory state.
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Mitigating Asymmetric Nonlinear Weight Update Effects in Hardware Neural Network Based on Analog Resistive Synapse

TL;DR: A two-layer perceptron network is successfully trained online and the classification accuracy of MNIST handwritten digit data set is improved by using 6-/8-b analog synapses, respectively, with extremely high asymmetric nonlinearity.
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Resistive random access memory (RRAM) technology: From material, device, selector, 3D integration to bottom-up fabrication

TL;DR: In this article, the development of resistive switching (RS) device technology including the fundamental physics, material engineering, three-dimensional integration, and bottom-up fabrication is reviewed, and options for 3D memory array architectures are presented for the mass storage application.