Journal ArticleDOI
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
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TLDR
The finding of the study indicates that the best SAC composition for drop impact performance is not necessarily the best composition for optimum thermal cycling reliability, and the level of Ag-content in SAC solder alloy can be an advantage or a disadvantage depending on the application, package and reliability requirements.About:
This article is published in Microelectronics Reliability.The article was published on 2012-01-01. It has received 208 citations till now. The article focuses on the topics: Temperature cycling & Drop impact.read more
Citations
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Journal ArticleDOI
Reliability issues of lead-free solder joints in electronic devices
TL;DR: This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration onThe reliability of solder joints.
Journal ArticleDOI
Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications
TL;DR: In this paper, the thermal and creep properties of Ni-doped lead-free solders have been investigated and it was shown that adding 0.05% Ni into the lead free SAC (0507) solder led to the microstructural refinement, more uniform distribution of the Ag 3 Sn, (Cu,Ni) 6 Sn 5 intermetallic compounds (IMCs) and small primary β-Sn grains.
Proceedings ArticleDOI
Correlation of reliability models including aging effects with thermal cycling reliability data
Mohammad Motalab,Muhannad Mustafa,Jeffrey C. Suhling,Jiawei Zhang,John L. Evans,Michael J. Bozack,Pradeep Lall +6 more
TL;DR: In this article, a new finite element based prediction procedure was developed that utilizes constitutive relations and failure criteria that incorporate aging effects, and then validated the new approach through correlation with thermal cycling accelerated life testing experimental data.
Journal ArticleDOI
Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance
TL;DR: In this article, the SiC nanoparticles were successfully fabricated by high energy ball milling to increase the primary β-Sn phase and decrease the percentage of Ag3Sn and Cu6Sn5 IMC particles, which produced a weak interface with the β-sn matrix.
Journal ArticleDOI
Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste
Tomohiro Yamakawa,Tadashi Takemoto,Masayoshi Shimoda,Hiroshi Nishikawa,Kunio Shiokawa,Nobuto Terada +5 more
TL;DR: In this article, a low-temperature bonding process utilizing Cu nanoparticle paste without addition of sintering promoter was investigated, and the formation of a dimple-like morphology was confirmed in the ductile fracture area.
References
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Journal ArticleDOI
Mechanisms of fatigue crack propagation in metals, ceramics and composites: Role of crack tip shielding☆
TL;DR: In this paper, the authors examined the effect of crack tip shielding on fatigue crack propagation behavior in metals, composites and ceramics, and showed that, whereas crack-tip shielding can provide a potent means of enhancing resistance to crack growth, such extrinsic toughening mechanisms can result in the apparently anomalous behavior of small cracks and to the susceptibility of brittle materials to fatigue failure.
Journal ArticleDOI
A review of mechanical properties of lead-free solders for electronic packaging
Hongtao Ma,Jeffrey C. Suhling +1 more
TL;DR: In this article, a review of the available data in the field and give rise to the possible factors including room temperature effects, which causes the large discrepancies of data for both lead-free and SnPb solders.
Physical Metallurgy I
Tanja Matković,Prosper Matković +1 more
TL;DR: Skripta Fizikalna metalurgija as mentioned in this paper sažeti prikaz znanosti o materijalima u kojoj se na znanstvenim i inženjerskim principima tumaci kristalna građa metala, dizajniranje legura i mikrostrukture, te odnos između strukture metala i njegovih mehanickih i fizickih svojstava.
Journal ArticleDOI
Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu
TL;DR: The effects of the fourth elements, i.e., Fe, Ni, Co, Mn and Ti, on microstructural features, undercooling characteristics, and monotonic tensile properties of Sn–3 wt.%Ag–0.%Cu lead-free solder were investigated and Ni alloy is more reliable solder alloy with improved properties for all tests in the present work.
Journal ArticleDOI
Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints
Abstract: The size and crystal orientation of Sn grains in Pb-free, near eutectic Sn-Ag-Cu solder joints were examined. A clear dependence of the thermomechanical fatigue response of these solder joints on Sn grain orientation was observed (Sn has a body centered tetragonal crystal structure). Fabricated joints tend to have three orientations in a cyclic twin relationship, but among the population of solder balls, this orientation triplet appears to be randomly oriented. In thermally cycled joints, solder balls with dominant Sn grains having the particular orientation with the c-axis nearly parallel to the plane of the substrate were observed to fail before neighboring balls with different orientations. This results from the fact that the coefficient of thermal expansion of Sn in the basal plane (along the alpha-axis) is half the value along the c-axis; joints observed to be damaged had the maximum coefficient of thermal expansion mismatch between solder and substrate at the joint interface, as well as a tensile stress modes during the hot part of the thermal cycle. Localized recrystallization was observed in regions of maximum strain caused by differential expansion conditions, and its connection with crack nucleation is discussed.
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A review of mechanical properties of lead-free solders for electronic packaging
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