Journal ArticleDOI
Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures
Frederic Marty,Lionel Rousseau,Bassam Saadany,Bruno Mercier,Olivier Français,Yoshio Mita,Tarik Bourouina +6 more
TLDR
Different processes involving an inductively coupled plasma reactor either for deep reactive ion etching or for isotropic etching of silicon for photonic MEMS application is presented.About:
This article is published in Microelectronics Journal.The article was published on 2005-07-01. It has received 301 citations till now. The article focuses on the topics: Reactive-ion etching & Isotropic etching.read more
Citations
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Journal ArticleDOI
High aspect ratio silicon etch: A review
TL;DR: High aspect ratio (HAR) silicon etch is reviewed in this paper, including commonly used terms, history, main applications, different technological methods, critical challenges, and main theories of the technologies.
Journal ArticleDOI
High-sensitivity optical monitoring of a micromechanical resonator with a quantum-limited optomechanical sensor
Olivier Arcizet,P. F. Cohadon,Tristan Briant,Michel Pinard,Antoine Heidmann,J. M. Mackowski,Christine Michel,L. Pinard,Olivier Français,Lionel Rousseau +9 more
TL;DR: The high-sensitivity optical monitoring of a micromechanical resonator and its cooling by active control and an optomechanical sensor based on a very high-finesse cavity are experimentally demonstrated.
Journal ArticleDOI
A batch-fabricated and electret-free silicon electrostatic vibration energy harvester
Philippe Basset,Dimitri Galayko,A. Mahmood Paracha,Frederic Marty,Andrii Dudka,Tarik Bourouina +5 more
TL;DR: In this paper, a novel silicon-based and batch-processed MEMS electrostatic transducer for harvesting and converting the energy of vibrations into electrical energy without using an electret layer is presented.
Journal ArticleDOI
Ultra-high aspect ratio high-resolution nanofabrication for hard X-ray diffractive optics.
Chieh Chang,Anne Sakdinawat +1 more
TL;DR: Significant progress is reported in ultra-high aspect ratio nanofabrication of high-resolution, dense silicon nanostructures using vertical directionality controlled metal-assisted chemical etching using high efficiency in the critical outer layers.
Journal ArticleDOI
Monolithic silicon‐micromachined free‐space optical interferometers onchip
TL;DR: In this paper, the authors present a review of optical micro-electro-mechanical systems (MEMS) realized on a silicon chip that is enabling accurate control of the etching depth, the aspect ratio, the verticality and the curvature of the etched surfaces.
References
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Journal ArticleDOI
Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperatures
M.J. de Boer,Johannes G.E. Gardeniers,Henri Jansen,E. Smulders,M.-J. Gilde,G. Roelofs,J.N. Sasserath,Miko Elwenspoek +7 more
TL;DR: In this paper, the authors present guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, employing SF/sub 6/O/sub 2/based high-density plasmas at cryogenic temperatures.
Journal ArticleDOI
Micromachining of buried micro channels in silicon
M.J. de Boer,R.W. Tjerkstra,Johan W. Berenschot,Henri Jansen,G.J. Burger,Johannes G.E. Gardeniers,Michael Curt Elwenspoek,A. van den Berg +7 more
TL;DR: In this paper, a new method for the fabrication of micro structures for fluidic applications, such as channels, cavities, and connector holes in the bulk of silicon wafers, called buried channel technology (BCT), is presented.
Journal ArticleDOI
SCREAM MicroElectroMechanical Systems
TL;DR: The SCREAM process yields high-aspect-ratio (>50:1) released, single crystal silicon structures with micrometer-scale minimum features and a suspension span of greater than 5 millimeters.
Journal ArticleDOI
The MEMSNAS process: microloading effect for micromachining 3-D structures of nearly all shapes
TL;DR: In this article, a one-mask process was proposed to take advantage of the microloading effect of reactive ion etching (RIE) to obtain multiple levels of heights in an array of microholes of different diameters.
Proceedings ArticleDOI
Cryogenic dry etching for high aspect ratio microstructures
TL;DR: In this article, the etching behavior of silicon and polyimide film has been investigated and the etch selectivity was over 900 at a power density of less than 4.0 W/cm/sup 2.
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