Journal ArticleDOI
Analysis of Lateral Thermal Coupling for GaN MMIC Technologies
Johan Bremer,Johan Bergsten,Lowisa Hanning,Torbjorn M.J. Nilsson,Niklas Rorsman,Sebastian Gustafsson,Axel Martin Eriksson,Mattias Thorsell +7 more
TLDR
In this paper, the lateral heat propagation in an AlGaN/GaN heterostructure grown on a silicon carbide substrate was investigated using a temperature sensor that utilizes the temperature-dependent $I$ − $V$ characteristic of a semiconductor resistor, making it suitable for integration in GaN monolithic microwave integrated circuit technologies.Abstract:
This paper presents a study of the lateral heat propagation in an aluminum gallium nitride/gallium nitride (AlGaN/GaN) heterostructure grown on a silicon carbide substrate The study is enabled by the design of a temperature sensor that utilizes the temperature-dependent $I$ – $V$ characteristic of a semiconductor resistor, making it suitable for integration in GaN monolithic microwave integrated circuit technologies Using the sensor, we are able to characterize the thermal transient response and extract lateral thermal time constants from the measurements Time constants in the range from 25 $\mu \text{s}$ to 12 ms are identified Furthermore, the heat propagation properties are characterized for heat source-to-sensor distances of 86– $484~\mu \text{m}$ , resulting in delay times from 35 to $111~\mu \text{s}$ It is shown that both the time constants and propagation delay increase with temperature An empirical model of the sensor current versus temperature and voltage is proposed and used to predict the junction temperature of the sensor The study provides knowledge for heat management design and proposes an integrated temperature measurement solution for future highly integrated GaN applicationsread more
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Proceedings ArticleDOI
Thermal Analysis of GaN/SiC-on-Si Assemblies: Effect of Bump Pitch and Thickness of SiC Layer
TL;DR: In this article, the thermal properties of a compact, heterogeneously integrated gallium nitride on silicon carbide (GaN-on-SiC) and silicon assembly are investigated.
References
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A new empirical nonlinear model for HEMT and MESFET devices
TL;DR: In this article, a large-signal model for HEMTs and MESFETs, capable of modeling the currentvoltage characteristic and its derivatives, including the characteristic transconductance peak, gate-source and gate-drain capacitances, is proposed.
Proceedings ArticleDOI
Temperature measurements of semiconductor devices - a review
TL;DR: There are several methods for measuring the temperature of an operating semiconductor device as discussed by the authors, which can be broadly placed into three generic categories: electrical, optical, and physically contacting. But, as discussed in Section 2.1, some of the advantages and disadvantages as well as the spatial, time, and temperature resolution are also provided.
Journal ArticleDOI
Thermal Boundary Resistance Between GaN and Substrate in AlGaN/GaN Electronic Devices
Andrei Sarua,Hangfeng Ji,K.P. Hilton,David J. Wallis,Michael J. Uren,Trevor Martin,Martin Kuball +6 more
TL;DR: In this article, the influence of thermal boundary resistance (TBR) on temperature distribution in ungated AlGaN/GaN field effect devices was investigated using 3-D micro-Raman thermography.
Book ChapterDOI
High Lattice Thermal Conductivity Solids
Donald T. Morelli,Glen A. Slack +1 more
TL;DR: In this article, the lattice thermal conductivity of various classes of crystalline solids is reviewed, with emphasis on materials with κ > 0.5Wcm−1K−1.
Journal ArticleDOI
Measurement of temperature distribution in multifinger AlGaN/GaN heterostructure field-effect transistors using micro-Raman spectroscopy
Martin Kuball,S Rajasingam,Andrei Sarua,Michael J. Uren,Trevor Martin,B.T. Hughes,K.P. Hilton,R.S. Balmer +7 more
TL;DR: In this paper, the temperature distribution in multifinger high-power AlGaN/GaN heterostructure field effect transistors grown on SiC substrates was studied using micro-Raman spectroscopy.