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Open AccessJournal ArticleDOI

Design and Characterization of High-Temperature ECL-Based Bipolar Integrated Circuits in 4H-SiC

TLDR
In this article, the performance of low-voltage 4H-SiC n-p-n bipolar transistors and digital integrated circuits based on emitter-coupled logic is demonstrated.
Abstract
Operation up to 300 °C of low-voltage 4H-SiC n-p-n bipolar transistors and digital integrated circuits based on emitter-coupled logic is demonstrated. Stable noise margins of about 1 V are reported for a two-input or- nor gate operated on - 15 V supply voltage from 27 °C up to 300 °C. In the same temperature range, an oscillation frequency of about 2 MHz is also reported for a three-stage ring oscillator.

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Citations
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Journal ArticleDOI

Sputtered Ohmic Cobalt Silicide Contacts to 4H-SiC

TL;DR: Ohmic CoSi2 contacts to n-type 4H-SiC showing low contact resistance have been made by sputter depositing sequential layers of Si and Co on 4HSiC substrates followed by a two-step rapid thermal anneal at 600 °C and 950 °C.
Proceedings ArticleDOI

Thermal evaluation of a liquid/air cooled integrated power inverter for hybrid vehicle applications

TL;DR: In this article, a double-side cooled SiC 50kW-1200V-200A power inverter for hybrid electric vehicle applications has been proposed to enable cooling in two different automotive operating environments: under-hood and controlled temperature environment of passenger compartment.
Proceedings ArticleDOI

500°C SiC-based driver IC for SiC power MOSFETs

TL;DR: In this article, a SiC BJT-based IC for driving SiC power MOSFETs operational from room temperature up to 500° C. The driver features design simplicity, smaller chip size, smaller propagation delay, and relatively high driving currents compared to similar SiC-based drivers.
Journal ArticleDOI

Influence of Ni and Nb thickness on low specific contact resistance and high-temperature reliability of ohmic contacts to 4H-SiC

TL;DR: In this article, the influence of Ni and Nb thickness on the electrical properties and high-temperature reliability of Ni(x)/Nb(100 − x)/n-type 4H-SiC ohmic contacts, where x = 25, 50 or 75 nm, was investigated.
Book ChapterDOI

Silicon Carbide High Temperature Electronics - Is This Rocket Science?

TL;DR: In this article, the SiC Electronics Exploration of Venus Proposed System for Venus Lander Results Conclusion is presented, along with an Introduction Advantages of SiC electronics exploration of Venus.
References
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MonographDOI

Process technology for silicon carbide devices

TL;DR: Zetterling, S.M.Ostling and S.J.Pearton as mentioned in this paper, S.Sveinbjornsson, S.-K.Lee, and M.
Journal ArticleDOI

Extreme temperature 6H-SiC JFET integrated circuit technology

TL;DR: In this article, the development of extreme temperature (up to 500 °C) integrated circuit technology based on epitaxial 6H-SiC junction field effect transistors (JFETs) is discussed.
Journal ArticleDOI

High Temperature Silicon Carbide CMOS Integrated Circuits

TL;DR: In this paper, the development of a 15V SiC CMOS technology developed to operate at high temperatures, n and p-channel transistor and preliminary circuit performance over temperature achieved in this technology.
Journal ArticleDOI

Digital CMOS IC's in 6H-SiC operating on a 5-V power supply

TL;DR: In this article, an implanted p-well process was used to construct the first 6H-SiC CMOS circuit with a 5V power supply for temperatures ranging from room temperature up to 300/spl deg/C.
Journal ArticleDOI

Surface-Passivation Effects on the Performance of 4H-SiC BJTs

TL;DR: In this article, the performance of bipolar junction transistor (BJT) is compared experimentally and by device simulation for 4H-SiC BJTs passivated with different surface passivation layers.
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