Proceedings ArticleDOI
Disconnection failure model and analysis of TSV-based 3D ICs
Do-Young Jung,Joohee Kim,Heegon Kim,Joung-Keun Kim,Joungho Kim,Jun So Pak +5 more
- pp 164-167
TLDR
In this paper, a gap between a TSV and the corresponding bump is calculated to analyse its effect on the system; the calculated values for 1 μm, 3 μm and 5 μm gap resulted in 14.07 fF, 4.69 fF and 2.82 fF respectively.Abstract:
The trend in semiconductor industry is rapidly shifting from 2-dimension to 3-dimension to satisfy the ever-growing demand on the miniaturization of electronic devices. The introduction of through silicon via (TSV) based 3-dimensional integrated circuit (3D-IC) has significantly advanced the technology to realize high speed system with increased functionality. However, challenges remain in reliability of fabrication and testing methods. The size of transistors and interconnections has shrunk to few tens of nanometers, requiring highly advanced technique in the fabrication process. The precision in existing fabrication process is insufficient to reach the acceptable level of chip yield. Thus, TSV failure detection and analysis is essential for 3D-IC technology. One of the main failures that degrades the chip performance is disconnection failure. Disconnection failure may form in any point along the channel, especially in between the stacked layers. Stacked dies with TSVs as interconnects can be analysed by equivalent circuit model. Each component is represented as lumped components according to its material and physical dimensions. A disconnection along the channel is a gap between two conducting materials, which is modelled as series capacitance. The gap between a TSV and the corresponding bump is calculated to analyse its effect on the system; the calculated values for 1 μm, 3 μm and 5 μm gap resulted in 14.07 fF, 4.69 fF, and 2.82 fF, respectively. The modelled components were inserted and S-parameter plots were extracted for analysis.read more
Citations
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Journal ArticleDOI
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis
Daniel H. Jung,Youngwoo Kim,Jonghoon J. Kim,Heegon Kim,Sumin Choi,Yoon-Ho Song,Hyun-Cheol Bae,Kwang-Seong Choi,Stefano Piersanti,Francesco de Paulis,Antonio Orlandi,Joungho Kim +11 more
TL;DR: In this article, the authors proposed a noninvasive defect analysis method for high-speed TSV channel with designed and fabricated test vehicles, and the proposed method is demonstrated with time-domain reflectometry measurement results.
Journal ArticleDOI
Challenges and Solutions in Emerging Memory Testing
TL;DR: The challenges and the emerging solutions in testing three classes of memories: 3D stacked memories, Resistive memories and Spin-Transfer-Torque Magnetic memories are discussed.
Proceedings ArticleDOI
Interconnect test for 3D stacked memory-on-logic
TL;DR: A new Memory Based Interconnect Test (MBIT) approach for 3D stacked memories with zero area overhead, the ability to detect both static and dynamic faults and perform at speed testing, flexibility in applying any test pattern, and extreme short test execution time is proposed.
Journal ArticleDOI
Post-Bond Interconnect Test and Diagnosis for 3-D Memory Stacked on Logic
TL;DR: A new memory-based interconnect test (MBIT) approach for 3-D memories stacked on logic (e.g., CPUs) with zero area overhead, the ability to detect both static and dynamic faults and perform at speed testing, and flexibility in applying any test pattern.
Proceedings ArticleDOI
Modeling and analysis of cracked through silicon via (TSV) interconnections
TL;DR: A lumped analytical electrical model for cracked (open fault) TSVs is proposed and verified by simulations using a commercial 3D resistance, capacitance and inductance extraction tool.
References
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Journal ArticleDOI
Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs
TL;DR: In this paper, the RLC parameters of the TSV are modeled as a function of physical parameters and material characteristics, and a TSV RLC model is applied to predict the resistance, inductance, and capacitances of small-geometry TSV architectures.
Journal ArticleDOI
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
Joohee Kim,Jun So Pak,Jonghyun Cho,Eakhwan Song,Jeonghyeon Cho,Heegon Kim,Taigon Song,Jun Ho Lee,Hyungdong Lee,Kunwoo Park,Seung-Taek Yang,Min Suk Suh,Kwang-Yoo Byun,Joungho Kim +13 more
TL;DR: In this article, the authors proposed a high-frequency scalable electrical model of a through silicon via (TSV) channel, which includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3D integrated circuit (IC) design.
Journal ArticleDOI
Characteristics of coplanar transmission lines on multilayer substrates: modeling and experiments
Erli Chen,Stephen Y. Chou +1 more
TL;DR: In this paper, conformal mapping of coplanar transmission lines on multilayer substrates expressed in analytic formulas has been used to verify the accuracy of these formulas using differential electro-optic (DEOS) sampling.
Proceedings ArticleDOI
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
TL;DR: In this article, a defect-tolerance technique for TSVs-based multi-bit links through an efficient and effective use of redundancy is presented, which is ideally suited for three-dimensional network-on-chip (NoC) links.
Journal ArticleDOI
New formulas of interconnect capacitances based on results of conformal mapping method
TL;DR: New formulas for the capacitances of the most common two-dimensional interconnect structures are presented, attaining an accuracy higher than previously known results, over a wide range of the geometrical parameters of the lines.
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