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Proceedings ArticleDOI

Embedded capacitors in the next generation processor

TLDR
Intel in collaboration with its suppliers has developed and commercialized a disruptive embedded capacitor technology that provides significant power delivery benefits for high performance computer applications and is the first commercialized embedded capacitors used by Intel.
Abstract
Embedded passives technology has been of interest to electronic package designers for performance improvement and package size reduction. With the explosion of mobile phones, tablets and other hand held devices, the need for smaller form factor products with equivalent or better electrical performance makes a very compelling case for embedding passives. The benefits of embedded passives are not limited to small form factor devices. Larger die and server products requiring high performance power delivery solutions can also benefit substantially from embedded capacitors. Intel in collaboration with its suppliers has developed and commercialized a disruptive embedded capacitor technology that provides significant power delivery benefits for high performance computer applications. This is the first commercialized embedded capacitor technology used by Intel.

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Citations
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Journal ArticleDOI

Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends

TL;DR: In this paper, the authors discuss the pros and cons of different types of integrated voltage regulators (IVRs) as well as the technology ingredients required to meet future IVR requirements.
Journal ArticleDOI

System Scaling With Nanostructured Power and RF Components

TL;DR: The impact of nanostructured materials toward enhancing the performance and miniaturization of power and radio-frequency (RF) passive components in emerging smart systems is shown.
Journal ArticleDOI

3-D CMOS Chip Stacking for Security ICs Featuring Backside Buried Metal Power Delivery Networks With Distributed Capacitance

TL;DR: In this paper, a 3D stack of complimentary metaloxide-semiconductor (CMOS) integrated circuit (IC) chips for security applications monolithically embed backside buried metal (BBM) routing with low series impedance and high decoupling capability in a power delivery network (PDN), thanks to distributed capacitances over a full-chip backside area.
Journal ArticleDOI

CMOS compatible on-chip decoupling capacitor based on vertically aligned carbon nanofibers

TL;DR: In this paper, an on-chip decoupling capacitor of specific capacitance 55 pF/mu m(2) (footprint area) which is 10 times higher than the commercially available discrete and onchip (65 nm technology node) decoupled capacitors is presented.
Proceedings ArticleDOI

Heterogeneous Power Delivery for 7nm High-Performance Chiplet-Based Processors Using Integrated Passive Device and In-Package Voltage Regulator

TL;DR: Two heterogeneous solutions to improve power delivery to High-Performance Computing (HPC) processors are demonstrated, including a laterally mounted in-Package Voltage Regulator built in 28nm CMOS augmented with high-per-meability on-die inductors.
References
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Proceedings ArticleDOI

Measurement-to-modeling correlation of the power delivery network impedance of a microprocessor system

TL;DR: An automated system for measuring the power delivery impedance profile on a functional system is presented in this paper, where the data collected by this system is used to assess the accuracy of a distributed power delivery system model.
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