scispace - formally typeset
Journal ArticleDOI

Online Gate-Oxide Degradation Monitoring of Planar SiC MOSFETs Based on Gate Charge Time

Reads0
Chats0
TLDR
In this paper , an online gate-oxide degradation monitoring method for planar SiC mosfets is proposed by extracting gate charge time at a specific range of gate voltage, which is theoretically analyzed and experimentally verified.
Abstract
Gate-oxide degradation has been one of the critical reliability concerns of silicon carbide (SiC) metal–oxide–semiconductor-field-effect transistors (mosfets), which could be monitored through aging-sensitive parameters. In this article, an online gate-oxide degradation monitoring method for planar SiC mosfets is proposed by extracting gate charge time at a specific range of gate voltage. It is based on the findings that the input capacitances of planar SiC mosfets change significantly over gate-oxide degradation, which is theoretically analyzed and experimentally verified. The capacitance variations are converted into the gate charge time as the new aging-sensitive parameter. The new parameter measurement circuit is proposed and integrated into the gate driver module. The article results indicate that the new parameter varies noticeably with gate-oxide degradation and the difference of this parameter caused by junction temperature is much smaller than that caused by degradation. Besides, the parameter is immune to package degradation and load current. The condition monitoring method can be implemented online since the parameter is extracted during the off-state of SiC mosfet devices, which does not affect normal operation. The confirmatory experiment is carried out to verify the correctness of the proposed method.

read more

Content maybe subject to copyright    Report

Citations
More filters
Journal ArticleDOI

Trap Characterization of Trench-Gate SiC MOSFETs Based on Transient Drain Current

TL;DR: In this article , a Bayesian deconvolution algorithm is used to optimize trap feature extraction based on the transient current method and improve the trap extraction accuracy, which can be combined with electrical stress testing in long-term reliability research to realize nondestructive characterization of the defects of SiC MOSFETs.

Characterization of Gate-Oxide Degradation Location for SiC MOSFETs Based on the Split C–V Method Under Bias Temperature Instability Conditions

TL;DR: In this paper , the effect of gate-oxide degradation on threshold voltage and split under dc and ac bias temperature instability (BTI) conditions is investigated and the degradation location is analyzed.

Trap Characterization of Trench-Gate SiC MOSFETs Based on Transient Drain Current

TL;DR: In this paper , a Bayesian deconvolution algorithm is used to optimize trap feature extraction based on the transient current method and improve the trap extraction accuracy, which can be combined with electrical stress testing in long-term reliability research to realize nondestructive characterization of the defects of SiC MOSFETs.
Journal ArticleDOI

A Half-Bridge-Level Gate-Oxide Failure Online Detection Method Without Invading Converters for SiC MOSFETs

TL;DR: In this article , a simple detection method of half-bridge-level gateoxide failure is proposed by connecting half-branch SiC MOSFETs and gate driver boards through the proposed circuit.
Journal ArticleDOI

An online gate oxide degradation monitoring method for SiC MOSFETs with contactless PCB Rogowski Coil approach

TL;DR: In this article , a contactless real-time degradation monitoring (DM) method based on the turn-on transient current rate with fixed delay time was proposed, which is realized by a Printed Circuit Board (PCB) Rogowski Coil.
References
More filters
Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TL;DR: In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Journal ArticleDOI

High-temperature electronics - a role for wide bandgap semiconductors?

TL;DR: It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300/spl deg/C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog VLSI in this temperature range.
Journal ArticleDOI

Basic Mechanisms of Threshold-Voltage Instability and Implications for Reliability Testing of SiC MOSFETs

TL;DR: In this article, a review of the basic mechanisms affecting the stability of the threshold voltage in response to bias-temperature stress is presented in terms of the charging and activation of near-interfacial oxide traps.
Journal ArticleDOI

Silicon Carbide Power MOSFET Model and Parameter Extraction Sequence

TL;DR: In this paper, the performance of a 2-kV, 5-A 4-H silicon carbide (SiC) power MOSFET was compared with a 400-V and 2kV SiC MOS FET, with the exception that the SiC device requires twice the gate drive voltage.
Journal ArticleDOI

Threshold voltage peculiarities and bias temperature instabilities of SiC MOSFETs

TL;DR: A new measure-stress-measure procedure for BTI evaluation of SiC MOSFETs is proposed which allows distinguishing between reversible threshold voltage hysteresis and more permanent threshold voltage drift (BTI).
Related Papers (5)