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Journal ArticleDOI

Percolation models for gate oxide breakdown

James H. Stathis
- 01 Nov 1999 - 
- Vol. 86, Iss: 10, pp 5757-5766
TLDR
In this article, the formation of a percolation path across a finite lattice is used to model dielectric breakdown in thin samples, and the critical defect density for breakdown shows a strong decrease with thickness below about 5 nm, then becomes constant below 3 nm.
Abstract
Computer calculations of the formation of a percolation path across a finite lattice are used to model dielectric breakdown. The classical scaling relations for percolation are expected to be valid only for large (finite) systems near pc. We investigate the opposite limit of very small samples, comparable to the lattice spacing. It is shown that relatively simple numerical calculations can quantitatively describe the statistics and thickness dependence of oxide breakdown in thin samples. The critical defect density for breakdown shows a strong decrease with thickness below about 5 nm, then becomes constant below 3 nm. Both of these features can be quantitatively explained by percolation on a finite lattice. The effective defect “size” of about 3 nm is obtained from the thickness dependence of the breakdown distributions. The model predicts a singular behavior when the oxide thickness becomes less than the defect size, because in this limit a single defect near the center of the oxide is sufficient to crea...

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Citations
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Journal ArticleDOI

High-κ gate dielectrics: Current status and materials properties considerations

TL;DR: In this paper, a review of the literature in the area of alternate gate dielectrics is given, based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success.
Book

Fundamentals of Modern VLSI Devices

Yuan Taur, +1 more
TL;DR: In this article, the authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices.
Journal ArticleDOI

Review on high-k dielectrics reliability issues

TL;DR: In this article, the authors review the status of reliability studies of high-k gate dielectrics and try to illustrate it with experimental results, showing that the reliability of Hf-based materials is influenced both by the interfacial layer as well as the high k layer.
Journal ArticleDOI

Dielectric breakdown mechanisms in gate oxides

TL;DR: In this paper, the authors focus on the case of gate dielectrics of interest for current Si microelectronics, i.e., Si oxides or oxynitrides of thickness ranging from some tens of nanometers down to about 1nm.
Journal ArticleDOI

Resistive switching phenomena: A review of statistical physics approaches

TL;DR: In this paper, the authors provide an overview of the underlying physics behind connectivity changes in highly conductive regions under an electric field, and discuss percolation model approaches and the theory for the scaling behaviors of numerous transport properties observed in RS.
References
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Book

Introduction to percolation theory

TL;DR: In this paper, a scaling solution for the Bethe lattice is proposed for cluster numbers and a scaling assumption for cluster number scaling assumptions for cluster radius and fractal dimension is proposed.
Book

Statistics of extremes

E. J. Gumbel
Journal ArticleDOI

Statistics of Extremes.

B. F. Kimball, +1 more
- 01 Mar 1961 - 
Journal ArticleDOI

Fractal Dimension of Dielectric Breakdown

TL;DR: In this article, it was shown that the simplest nontrivial stochastic model for dielectric breakdown naturally leads to fractal structures for the discharge pattern, and the results were compared with properly designed experiments.
Journal ArticleDOI

Impact ionization, trap creation, degradation, and breakdown in silicon dioxide films on silicon

TL;DR: In this article, two mechanisms triggered by electron heating in the oxide conduction band are discussed: trap creation and band gap ionization by carriers with energies exceeding 2 and 9 eV, respectively.
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