Kern Rim

TL;DR: In this paper, deep submicron strained-Si n-MOSFETs were fabricated on strained Si/relaxed Si/sub 0.8/Ge/sub sub 0.2/ heterostructures to yield well matched channel doping profiles after processing, allowing comparison of strained and unstrained Si surface channel devices.

TL;DR: In this article, current drive enhancements were demonstrated in the strained-Si PMOSFETs with sub-100 nm physical gate lengths for the first time, as well as in the NMOSFets with well-controlled threshold voltage V/sub T/ and overlap capacitance C/sub OV/ characteristics for L/sub poly/ and L/ sub eff/ below 80 nm and 60 nm.

TL;DR: In this article, the authors discuss device characteristics such as gate leakage currents, flatband voltage shifts, charge trapping, channel mobility, as well as integration and processing aspects for high-K dielectric integration into current Si technology.

TL;DR: In this article, a tensile-strained Si layer was transferred to form an ultra-thin (<20 nm) strained Si directly on insulator (SSDOI) structure and electron and hole mobility enhancements were demonstrated.

TL;DR: In this paper, a 70% increase in electron mobility was observed at vertical fields as high as 1.5 MV/cm for the first time, suggesting a new mobility enhancement mechanism in addition to reduced phonon scattering.