Proceedings ArticleDOI
Characteristics and device design of sub-100 nm strained Si N- and PMOSFETs
Kern Rim,Jack O. Chu,Huajie Chen,Keith A. Jenkins,Thomas S. Kanarsky,Kam-Leung Lee,Anda Mocuta,Huilong Zhu,Ronnen Andrew Roy,J. Newbury,John A. Ott,K. Petrarca,Patricia M. Mooney,D. Lacey,Steven J. Koester,Kevin K. Chan,Diane C. Boyd,Meikei Ieong,Hon-Sum Philip Wong +18 more
- pp 98-99
TLDR
In this article, current drive enhancements were demonstrated in the strained-Si PMOSFETs with sub-100 nm physical gate lengths for the first time, as well as in the NMOSFets with well-controlled threshold voltage V/sub T/ and overlap capacitance C/sub OV/ characteristics for L/sub poly/ and L/ sub eff/ below 80 nm and 60 nm.Abstract:
Current drive enhancements were demonstrated in the strained-Si PMOSFETs with sub-100 nm physical gate lengths for the first time, as well as in the NMOSFETs with well-controlled threshold voltage V/sub T/ and overlap capacitance C/sub OV/ characteristics for L/sub poly/ and L/sub eff/ below 80 nm and 60 nm. A 110% enhancement in the electron mobility was observed in the strained Si devices with 1.2% tensile strain (28% Ge content in the relaxed SiGe buffer), along with a 45% increase in the peak hole mobility.read more
Citations
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Journal ArticleDOI
Three-dimensional integrated circuits
Anna W. Topol,D.C. La Tulipe,L. Shi,David J. Frank,K. Bernstein,Steven E. Steen,Arvind Kumar,G. U. Singco,A. M. Young,K. W. Guarini,Meikei Ieong +10 more
TL;DR: The process steps and design aspects that were developed at IBM to enable the formation of stacked device layers are reviewed, including the descriptions of a glass substrate process to enable through-wafer alignment and a single-damascene patterning and metallization method for the creation of high-aspect-ratio capability.
Journal ArticleDOI
A 90-nm logic technology featuring strained-silicon
Scott E. Thompson,Mark Armstrong,C. Auth,Mohsen Alavi,M. Buehler,R. Chau,S. Cea,Tahir Ghani,G. Glass,T. Hoffman,Chia-Hong Jan,C. Kenyon,Jason Klaus,K. Kuhn,Z. Ma,B. McIntyre,Kaizad Mistry,Anand Portland Murthy,B. Obradovic,Ramune Nagisetty,P. Nguyen,Swaminathan Sivakumar,R. Shaheed,Lucian Shifren,B. Tufts,S. Tyagi,M. Bohr,Y. El-Mansy +27 more
TL;DR: In this paper, a leading-edge 90-nm technology with 1.2-nm physical gate oxide, 45-nm gate length, strained silicon, NiSi, seven layers of Cu interconnects, and low/spl kappa/CDO for high-performance dense logic is presented.
Journal ArticleDOI
Considerations for Ultimate CMOS Scaling
TL;DR: Transistor architectures such as extremely thin silicon-on-insulator and FinFET (and related architecture such as TriGate, Omega-FET, Pi-Gate), as well as nanowire device architectures, are compared and contrasted.
Patent
Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same
TL;DR: In this article, the authors describe a method for fabricating FETs with impurity-free regions of the strained material layers of the semiconductor, where the impurities are kept free of impurities that can interdiffuse from adjacent portions of the FET.
Journal ArticleDOI
Comparison of threshold-voltage shifts for uniaxial and biaxial tensile-stressed n-MOSFETs
TL;DR: In this paper, the deformation potential theory was used to quantify the effect of strain on threshold voltages for uniaxial and biaxially tensile-stressed silicon (Si) n-channel MOSFETs.
References
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Journal ArticleDOI
Thermal and Electrical Properties of Heavily Doped Ge‐Si Alloys up to 1300°K
TL;DR: In this paper, the thermal resistivity, Seebeck coefficient, electrical resistivity and Hall mobility of GeSi alloys have been measured throughout the GeSi alloy system as functions of impurity concentration in the range 2×1018−4×1020cm−3, and of temperature in range 300°-1300°K.