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Zhong Chen

Researcher at Nanyang Technological University

Publications -  1114
Citations -  37928

Zhong Chen is an academic researcher from Nanyang Technological University. The author has contributed to research in topics: Chemistry & Catalysis. The author has an hindex of 80, co-authored 1000 publications receiving 28171 citations. Previous affiliations of Zhong Chen include Institute of High Performance Computing Singapore & National Institute of Education.

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Journal ArticleDOI

Interface mechanism of peroxymonosulfate activation by cobalt-copper-ferrite nanoparticles mediated by palygorskite for bisphenol S degradation: A dual-path activation mechanism

TL;DR: In this paper , a dual-path activation mechanism was proposed for VO-assisted peroxymonosulfate (PMS)-assisted advanced oxidation processes for water purification, and the VO was confirmed by systematic characterizations and theoretical calculations.
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High-resolution NMR spectra in inhomogeneous fields utilizing the CRAZED sequence without coherence selection gradients

TL;DR: The measured linewidth of reconstructing 1D high-resolution spectral peaks does not depend on the dipolar correlation distance determined by the coherence selection gradients, but is only affected by diffusion and T(2) relaxation, suggesting the need to reconsider the mechanism for the iMQC-based high- resolution spectroscopy.
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Modification of Ta/polymeric low-k interface by electron-beam treatment

TL;DR: In this article, the adhesion energy of barrier layer porous polyarylene ether (PAE) interface was quantitatively measured by a four-point bending technique, and the obtained G c value of pristine Ta/PAE interface was 5.9 ′ 1.1 J/m 2.
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Investigation on the complex of diperoxovanadate with picolinamide.

TL;DR: A novel diperoxovanadate complex NH(4)[OV(O(2))(2)(picolinamide)].H(2)O was synthesized from aqueous solution under physiological conditions and was determined at 223K by single-crystal X-ray diffraction method.
Proceedings ArticleDOI

Amorphous metallic thin films as copper diffusion barrier for advanced interconnect applications

TL;DR: In this article, the performance of binary transition metal (Ta-transition metal) films of Ta-Transition metal (TM = Ni, Cr, Ti) was examined as a potential copper diffusion barrier, and it was concluded that Ta-Cr and Ta-Ni has higher glass forming ability and higher thermal stability compared to Ta-Ti films.