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Journal ArticleDOI

Critical properties of nanoporous low dielectric constant films revealed by Brillouin light scattering and surface acoustic wave spectroscopy

C.M. Flannery, +4 more
- 10 Jun 2002 - 
- Vol. 80, Iss: 24, pp 4594-4596
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TLDR
In this article, Brillouin light scattering and surface acoustic wave spectroscopy are used to measure density, porosity and stiffness properties of nanoporous methylsilsesquioxane films of low-k value.
Abstract
Thin porous films with nanometer pore sizes are the subject of intense interest, primarily because of their reduced dielectric constant k. The lack of useful characterization tools and the reduction in film mechanical properties with increasing porosity have severely hindered their development and application. We show that both Brillouin light scattering and surface acoustic wave spectroscopy allow one to measure density, porosity and stiffness properties of nanoporous methylsilsesquioxane films of low-k value. Excellent correlations are observed among independent measurements of density, porosity and the Young’s modulus which show that the results obtained are reliable and reveal properties of the films which are difficult or impossible to obtain using other techniques.

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Citations
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Journal ArticleDOI

Low dielectric constant materials for microelectronics

TL;DR: In this paper, a review of porosity in on-chip wires can be found, with an attempt to give an overview of the classification, the character, and the characteristics of the porosity.
Journal ArticleDOI

A buckling-based metrology for measuring the elastic moduli of polymeric thin films

TL;DR: An elegant, efficient measurement method that yields the elastic moduli of nanoscale polymer films in a rapid and quantitative manner without the need for expensive equipment or material-specific modelling is introduced.
Journal ArticleDOI

Chemical mechanical planarization for microelectronics applications

TL;DR: An overview of the CMP process in general, the science and mechanism of polishing, different metal and dielectric CMP processes as well as the future trends are discussed in this paper.
Journal ArticleDOI

Non-destructive characterisation of porous low-k dielectric films

TL;DR: In this article, the results of comparative analysis of different instrumentations are presented, including ellipsometric porosimetry, small-angle neutron and X-ray scattering combined with specular Xray reflectivity and positron annihilation lifetime spectroscopy.
Journal ArticleDOI

Nanoporous polymeric materials: A new class of materials with enhanced properties

TL;DR: Nanoporous polymeric materials are porous materials with pore sizes in the nanometer range (i.e., below 200nm), processed as bulk or film materials, and from a wide set of polymers as discussed by the authors.
References
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Book

Wave propagation in elastic solids

TL;DR: In this article, the linearized theory of elasticity was introduced and the elasticity of a one-dimensional motion of an elastic continuum was modeled as an unbound elastic continuum.
Journal ArticleDOI

Nanoindentation of polymers: an overview

TL;DR: A review of the application of instrumented indentation devices to the measurement of the elastic modulus of polymeric materials is reviewed in this paper, which includes a summary of traditional analyses of load-penetration data and a discussion of associated uncertainties.
Journal ArticleDOI

Progress in Electroluminescent Devices Using Molecular Thin Films

Tetsuo Tsutsui
- 01 Jun 1997 - 
TL;DR: A variety of molecular materials such as vacuum-sublimed dye films, fully π-conjugated polymers, polymers with chromophores or skeletal chains, or side chains can be used for EL devices as mentioned in this paper.
Journal ArticleDOI

Properties of nanoporous silica thin films determined by high-resolution x-ray reflectivity and small-angle neutron scattering

TL;DR: In this article, a new methodology based on a high-resolution specular x-ray reflectivity and small-angle neutron scattering has been developed to evaluate the structural properties of low-dielectric-constant porous silica thin films about one micrometer thick supported on silicon wafer substrates.
Journal ArticleDOI

Non-destructive evaluation of diamond and diamond-like carbon films by laser induced surface acoustic waves

TL;DR: In this article, a photoacoustic technique was developed which enables the film modulus to be determined for rather small samples such as cutting tools based on the measurement of the surface wave velocity vs. frequency.
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