Journal ArticleDOI
Critical properties of nanoporous low dielectric constant films revealed by Brillouin light scattering and surface acoustic wave spectroscopy
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TLDR
In this article, Brillouin light scattering and surface acoustic wave spectroscopy are used to measure density, porosity and stiffness properties of nanoporous methylsilsesquioxane films of low-k value.Abstract:
Thin porous films with nanometer pore sizes are the subject of intense interest, primarily because of their reduced dielectric constant k. The lack of useful characterization tools and the reduction in film mechanical properties with increasing porosity have severely hindered their development and application. We show that both Brillouin light scattering and surface acoustic wave spectroscopy allow one to measure density, porosity and stiffness properties of nanoporous methylsilsesquioxane films of low-k value. Excellent correlations are observed among independent measurements of density, porosity and the Young’s modulus which show that the results obtained are reliable and reveal properties of the films which are difficult or impossible to obtain using other techniques.read more
Citations
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Journal ArticleDOI
Low dielectric constant materials for microelectronics
Karen Maex,Mikhail R. Baklanov,Denis Shamiryan,F. lacopi,Sywert Brongersma,Z. S. Yanovitskaya +5 more
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A buckling-based metrology for measuring the elastic moduli of polymeric thin films
Christopher M. Stafford,Christopher Harrison,Kathryn L. Beers,Alamgir Karim,Eric J. Amis,Mark R. VanLandingham,Mark R. VanLandingham,Ho-Cheol Kim,Willi Volksen,Robert D. Miller,Eva E. Simonyi +10 more
TL;DR: An elegant, efficient measurement method that yields the elastic moduli of nanoscale polymer films in a rapid and quantitative manner without the need for expensive equipment or material-specific modelling is introduced.
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Chemical mechanical planarization for microelectronics applications
TL;DR: An overview of the CMP process in general, the science and mechanism of polishing, different metal and dielectric CMP processes as well as the future trends are discussed in this paper.
Journal ArticleDOI
Non-destructive characterisation of porous low-k dielectric films
TL;DR: In this article, the results of comparative analysis of different instrumentations are presented, including ellipsometric porosimetry, small-angle neutron and X-ray scattering combined with specular Xray reflectivity and positron annihilation lifetime spectroscopy.
Journal ArticleDOI
Nanoporous polymeric materials: A new class of materials with enhanced properties
TL;DR: Nanoporous polymeric materials are porous materials with pore sizes in the nanometer range (i.e., below 200nm), processed as bulk or film materials, and from a wide set of polymers as discussed by the authors.
References
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Book
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Journal ArticleDOI
Nanoindentation of polymers: an overview
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Journal ArticleDOI
Progress in Electroluminescent Devices Using Molecular Thin Films
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Journal ArticleDOI
Properties of nanoporous silica thin films determined by high-resolution x-ray reflectivity and small-angle neutron scattering
Wen-Li Wu,William E. Wallace,Eric K. Lin,Gary W. Lynn,Charles J. Glinka,E. Todd Ryan,Huei-Min Ho +6 more
TL;DR: In this article, a new methodology based on a high-resolution specular x-ray reflectivity and small-angle neutron scattering has been developed to evaluate the structural properties of low-dielectric-constant porous silica thin films about one micrometer thick supported on silicon wafer substrates.
Journal ArticleDOI
Non-destructive evaluation of diamond and diamond-like carbon films by laser induced surface acoustic waves
TL;DR: In this article, a photoacoustic technique was developed which enables the film modulus to be determined for rather small samples such as cutting tools based on the measurement of the surface wave velocity vs. frequency.
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