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Journal ArticleDOI

Impact of a Spacer Layer on the Analog Performance of Asymmetric InP/InGaAs nMOSFETs

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TLDR
In this article, an extensive numerical analysis is performed to study and evaluate the impact of a dielectric sidewall spacer layer on the various device parameters associated with analog circuit performance of In0.75Ga0.25As channel asymmetric nMOSFETs with InP drain at two different channel lengths of 20 and 30 nm.
Abstract
An extensive numerical analysis is performed to study and evaluate the impact of a dielectric sidewall spacer layer on the various device parameters associated with analog circuit performance of In0.75Ga0.25As channel asymmetric nMOSFETs with InP drain at two different channel lengths ( $L_{g}$ ) of 20 and 30 nm. The numerical simulation deck is calibrated with asymmetric InGaAs MOSFET experimental characteristics reported in the literature. Our investigations reveal that device parameters such as transconductance $g_{m}$ , transconductance generation factor, and voltage gain $A_{v}$ exhibit significant improvement when a spacer of high dielectric constant $k$ , such as 25, and small length $L_{\textrm {sp}}$ , such as 5 nm, are used for both $L_{g}= 20$ and 30 nm. On the contrary, the output conductance and unity gain cutoff frequency are found to reduce and increase, respectively, with lower $k$ and larger $L_{\textrm {sp}}$ of the spacer. Our studies suggest that improved analog performance of In-rich asymmetric InGaAs MOSFETs can be achieved by spacer layer engineering at advanced technology nodes.

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Citations
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Journal ArticleDOI

Performance optimization of nanoscale junctionless transistors through varying device design parameters for ultra-low power logic applications

TL;DR: In this paper, the effects of channel doping concentration, dielectric constant of underlap spacers, source/drain resistance on logic performance of 20-nm gate length JL MOSFETs in terms of ON-current at a given OFF-current, subthreshold swing, gate capacitance and intrinsic delay for supply voltages ranging 0.4-0.75
Journal ArticleDOI

Study of G-S/D underlap for enhanced analog performance and RF/circuit analysis of UTB InAs-OI-Si MOSFET using NQS small signal model

TL;DR: The underlap technique improves the gate electrostatic integrity which in turn improves the analog performance of the device with the help of technology computer-aided design (TCAD) simulation, calibrated with Schrodinger-Poisson solver and experimental results.
Journal ArticleDOI

Impact of sidewall spacer on n-InGaAs devices and hybrid InGaAs/Si CMOS amplifiers in deca-nanometer regime

TL;DR: In this article, the influence of the sidewall spacers on the analog performance of InGaAs nMOSFETs at channel lengths of 32 and 22nm was investigated in analog domain.
Journal ArticleDOI

Development of noise model for InAsSb MOSFETs and their application in low noise amplifiers

TL;DR: In this article, the authors developed a low frequency noise model for symmetric double gate InAsSb channel n-MOSFETs and reported noise performance of such devices as well as amplifier circuits built using them.
Journal ArticleDOI

Negative bias temperature instability (NBTI) effects on p-Si/n-InGaAs hybrid CMOSFETs for digital applications

TL;DR: In this paper, the influence of negative bias temperature temperature instability (pMOS-NBTI) on the logic performance degradation of a hybrid CMOS inverter, comprising Si pMOS and In0.70Ga0.30As nMOS device, was investigated in terms of high noise margin (NMH), rise time (tr), delay (td), and oscillators with reference to frequency of oscillations.
References
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Journal ArticleDOI

GaAs, AlAs, and AlxGa1−xAs: Material parameters for use in research and device applications

TL;DR: In this article, a review of the properties of the Al x Ga1−x As/GaAs heterostructure system is presented, which can be classified into sixteen groups: (1) lattice constant and crystal density, (2) melting point, (3) thermal expansion coefficient, (4), lattice dynamic properties, (5) lattices thermal properties,(6) electronic-band structure, (7) external perturbation effects on the bandgap energy, (8) effective mass, (9) deformation potential, (10) static and
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A new recombination model for device simulation including tunneling

TL;DR: In this article, a recombination model for device simulation that includes both trap-assisted tunneling (under forward and reverse bias) and band-to-band tunneling is presented, which makes it easy to implement in a numerical device simulator.
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A physically based mobility model for numerical simulation of nonplanar devices

TL;DR: A local mobility function, set up in terms of a simple Mattiessen's rule, provides a careful description of MOSFET operation in a wide range of normal (or gate) electric fields.
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Band offsets of high K gate oxides on III-V semiconductors

TL;DR: In this article, the band offsets of various gate dielectrics including HfO2, Al2O3, Gd2O 3, Si3N4, and SiO2 on III-V semiconductors such as GaAs, InAs, GaSb, and GaN have been calculated using the method of charge neutrality levels.
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A new analytical diode model including tunneling and avalanche breakdown

TL;DR: In this paper, an analytical model describing reverse and forward DC characteristics is presented, based on the solution of the hole continuity equation in the depletion layer of a p-n junction and incorporating the following physical mechanisms: band-to-band tunneling, trap-assisted tunneling (both under forward and reverse bias), Shockley-Read-Hall recombination, and avalanche breakdown.
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