Patent
Nanoscale wires and related devices
Charles M. Lieber,Xiangfeng Duan,Yi Cui,Yu Huang,Mark S. Gudiksen,Lincoln J. Lauhon,Jiangfang Wang,Hongkun Park,Qingqiao Wei,Wenjie Liang,David C. Smith,Deli Wang,Zhaohui Zhong +12 more
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TLDR
In this paper, the fabrication and growth of sub-microelectronic circuitry is described, and the arrangement of such articles to fabricate electronic, optoelectronic, or spintronic devices and components.Citations
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Medical device applications of nanostructured surfaces
TL;DR: In this article, a nanofiber enhanced surface area substrates and structures comprising such substrates for use in various medical devices, as well as methods and uses for such substrate and medical devices are disclosed.
Patent
Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
Arun Majumdar,Ali Shakouri,Timothy D. Sands,Peidong Yang,Samuel S. Mao,Richard E. Russo,H. Feick,Eicke R. Weber,Hannes Kind,Michael H. Huang,Haoquan Yan,Yiying Wu,Rong Fan +12 more
TL;DR: One-dimensional nanostructures have uniform diameters of less than approximately 200 nm and are referred to as "nanowires" as mentioned in this paper, which include single-crystalline materials having different chemical compositions.
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Nanostructure-Enhanced Platelet Binding and Hemostatic Structures
TL;DR: In this article, methods, systems, and apparatuses for nanomaterial-enhanced platelet binding and hemostatic medical devices are provided, including platelet bindings and the coagulation of blood at a wound/opening caused by trauma, a surgical procedure, ulceration, or other cause.
Patent
Large-area nanoenabled macroelectronic substrates and uses therefor
Xiangfeng Duan,Chunming Niu,Stephen Empedocles,Linda T. Romano,Jian Chen,Vijendra Sahi,Lawrence Bock,David P. Stumbo,J. Wallace Parce,Jay L. Goldman +9 more
TL;DR: In this article, a thin film of nanowires is formed on a substrate, and contacts are formed at the semiconductor device regions to provide electrical connectivity to the plurality of semiconductor devices.
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Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
TL;DR: A bulk-doped semiconductor is a semiconductor that is at least one of the following: a single crystal, an elongated and bulk-depletioned semiconductor with a largest cross-sectional dimension less than 500 nanometers as discussed by the authors.
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Covalent carbon nitride material comprising C2 N and formation method
TL;DR: In this paper, a method of forming a covalent carbon material includes forming an atomic nitrogen source, forming an elemental reagent source and combining the atomic nitrogen, elemental reagents to form the C 2 N and annealing it.
Patent
The use of 1d semiconductor materials as chemical sensing materials, produced and operated close to room temperature
TL;DR: In this article, a chemical sensor device consisting of a substrate, a sensor medium formed on the substrate, and the sensor medium comprising one-dimensional nanoparticles, wherein the one dimensional nanoparticles essentially consist of a semiconducting AxBy compound, e.g. V2O5, is presented.
Patent
Noncovalent sidewall functionalization of carbon nanotubes
Hongjie Dai,Robert J. Chen +1 more
TL;DR: In this paper, single-wall carbon nanotubes (SWNTs) are noncovalently functionalized in a broadly applicable manner, being useful for a variety of implementations, including for the immobilization of molecules, for circuit arrangements, molecular electronics and for molecular sensors.
Patent
Print media vacuum holddown
Steve O. Rasmussen,John D Rhodes +1 more
TL;DR: In this paper, a vacuum holddown for sheet materials has a surface having a field of vacuum ports in which each individual port is gated, and when a vacuum is applied to the underside of the holddown, the gates close.
Patent
Method of manufacturing a semiconductor device
Kodera Masako,Matsui Yoshitaka +1 more
TL;DR: In this article, a method of manufacturing a semiconductor device, comprising preparing a base comprising a substrate having a device surface side, a p-type semiconductor layer formed on the device surface of the semiconductor substrate, and wirings formed above the substrate and electrically connected to each other via the p-n junction, is presented.