Journal ArticleDOI
REBL: A novel approach to high speed maskless electron beam direct write lithography
Paul Petric,Christopher F. Bevis,Allen Carroll,Henry Percy,Marek Zywno,Keith Standiford,Alan D. Brodie,Noah Bareket,Luca Grella +8 more
TLDR
In this paper, the reflective electron beam lithography (REBL) system is proposed for high throughput maskless lithography, targeting five to seven wafer levels per hour throughput on average at the 45nm node, with extendibility to the 32nm node and beyond.Abstract:
The system concepts used in a novel approach for a high throughput maskless lithography system called reflective electron beam lithography (REBL) are described. The system is specifically targeting five to seven wafer levels per hour throughput on average at the 45nm node, with extendibility to the 32nm node and beyond. REBL incorporates a number of novel technologies to generate and expose lithographic patterns at estimated throughputs considerably higher than electron beam lithography has been able to achieve as yet. A patented reflective electron optic concept enables the unique approach utilized for the digital pattern generator (DPG). The DPG is a complementary metal oxide semiconductor application specific integrated circuit chip with an array of small, independently controllable metallic cells or pixels, which act as an array of electron mirrors. In this way, the system is capable of generating the pattern to be written using massively parallel exposure by ∼1×106 beams at extremely high data rates ...read more
Citations
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Journal ArticleDOI
Lithography, metrology and nanomanufacturing.
TL;DR: Future nanomanufacturing may well necessitate "cheap" nanometre scale metrology which functions real time and on-line, e.g. at GHz rates, in the production stream.
Journal ArticleDOI
Atomic Layer Deposition of W:Al2O3 Nanocomposite Films with Tunable Resistivity†
Anil U. Mane,Jeffrey W. Elam +1 more
TL;DR: In this article, tungsten-aluminum oxide (W:Al2O3) thin films were prepared by atomic layer deposition (ALD) using tengsten hexafluoride (WF6) and disilane (Si2H6) for the W ALD and trimethyl aluminum (TMA) and H2O 3 for the Al 2O3 ALD.
Journal ArticleDOI
Top-down nanomanufacturing
Matthias Imboden,David J. Bishop +1 more
TL;DR: In this paper, an integrated circuit with nanomaterial components can revolutionize technology, but only if they can be economically fabricated in large numbers, and this is not the case in many cases.
Proceedings ArticleDOI
New prospects for electron beams as tools for semiconductor lithography
TL;DR: In this paper, the early proofs of concept demonstrations of these techniques are presented and the main subject of the paper is the early proof-of-concept demonstrations of electron beam lithography.
Journal ArticleDOI
Reflective electron beam lithography: A maskless ebeam direct write lithography approach using the reflective electron beam lithography concept
Paul Petric,Christopher F. Bevis,Mark A. McCord,Allen Carroll,Alan D. Brodie,Upendra Ummethala,Luca Grella,Anthony Cheung,Regina Freed +8 more
TL;DR: The projected system throughput performance with the integrated technology of the reflective optics, DPG, and a multiple wafer rotary stage will be shown incorporating the performance data for the new column design.
References
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Journal ArticleDOI
EBES: A practical electron lithographic system
TL;DR: The electron beam exposure system (EBES) as discussed by the authors combines continuous translation of the mask or wafer substrate with periodic deflection of the electron beam in a raster-scan mode of exposure.
Journal ArticleDOI
Scattering with angular limitation projection electron beam lithography for suboptical lithography
TL;DR: The scattering with angular limitation projection electron-beam lithography (SCALPEL) approach combines the high resolution and wide process latitude inherent in electron beam lithography with the throughput of a parallel projection system as mentioned in this paper.
Journal ArticleDOI
PREVAIL - An e-beam stepper with Variable Axis Immersion Lenses
Hans C. Pfeiffer,Werner Stickel +1 more
TL;DR: Project PREVAIL (Projection Exposure with Variable Axis Immersion Lenses) has been initiated to develop an e-beam alternative to ''sub-optical'' lithography, providing superior resolution and pattern placement accuracy at competitive throughput as mentioned in this paper.
Journal ArticleDOI
Optimized overlay metrology marks: theory and experiment
M. Adel,M. Ghinovker,B. Golovanevsky,P. Izikson,E. Kassel,D. Yaffe,Alfred M. Bruckstein,Roman Goldenberg,Yossi Rubner,Michael Rudzsky +9 more
TL;DR: A thorough testing performed on the new grating marks shows a strong correlation with the underlying theory and demonstrate the superior quality of the new design over the overlay patterns used today.