Journal ArticleDOI
Superlattice $\mu {\rm TEC}$ Hot Spot Cooling
TLDR
In this paper, the results of 3-D, electrothermal, finite element modeling of a superlattice microcooler were provided, focusing on the hot spot temperature and surface temperature reductions, respectively.Abstract:
Proposed uses of solid-state thermoelectric microcoolers for hot spot remediation have included the formation of a superlattice layer on the back of the microprocessor chip, but there have been few studies on the cooling performance of such devices. This paper provides the results of 3-D, electrothermal, finite element modeling of a superlattice microcooler, focusing on the hot spot temperature and superlattice surface temperature reductions, respectively. Simulated temperature distributions and heat flow patterns in the silicon, associated with variations in microcooler geometry, chip thickness, hot spot size, hot spot heat flux, and superlattice thickness are provided. Comparison is made to hot spot cooling achieved by the Peltier effect in the silicon microprocessor chip itself. The numerical results suggest that, for a variety of operating conditions and geometries, while increasing the superlattice thickness serves to decrease the exposed superlattice surface temperature, it is ineffective in reducing the hot spot temperature below that due to the silicon Peltier effect.read more
Citations
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Journal ArticleDOI
Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review
TL;DR: In this article, the advantages and shortcomings of thermal enhancement technologies in different structural micro heat sinks are presented, and the barriers and challenges for the developments of thermal management of electronic devices by micro heat sink are discussed, and future directions of the research topic are provided.
Journal ArticleDOI
Hotspot thermal management using a microchannel-pinfin hybrid heat sink
Danish Ansari,Kwang-Yong Kim +1 more
TL;DR: In this article, an energy-efficient micro heat sink was proposed for thermal management of microprocessors with heterogeneous power distributions, where rectangular microchannels were used over the low heat-flux zone (background area), and an array of cylindrical pinfins were incorporated over the high heat-fluid zone (hotspot area) of the heat sink.
Journal ArticleDOI
Ultrathin Thermoelectric Devices for On-Chip Peltier Cooling
TL;DR: In this paper, the authors developed a computational model to investigate the effect of steady state and transient mode of operation of ultrathin thermoelectric cooler (TEC) devices on hot-spot cooling considering the effects of crucial thermal and electrical contact resistances.
Journal ArticleDOI
Hotspot Mitigating With Obliquely Finned Microchannel Heat Sink—An Experimental Study
Abstract: Sectional oblique fins are employed, in contrast to continuous fins, in order to modulate the flow in a microchannel heat sink. The breakage of continuous fin into oblique sections leads to reinitialization of boundary layers and generation of secondary flows that significantly enhance the cooling performance of the heat sink. In addition, an oblique finned microchannel heat sink has the flexibility to tailor local heat transfer performance by varying its oblique fin pitch. Clusters of oblique fins at higher density can be created in order to promote a greater degree of boundary layer redevelopment and secondary flow generation to provide more effective cooling at the high heat-flux region. Thus, the variation of oblique fin pitch can be exploited for hotspot mitigation. Experimental studies of a silicon chip with two hotspot scenarios show that the temperature hike and the temperature difference for the enhanced microchannel heat sink with variable pitch are reduced by as much as 17.1 °C and 15.4 °C, respectively. As a result, temperature distribution across the silicon chip is more uniform. In addition, the associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective hotspot mitigating strategy for the single-phase microchannel heat sink.
Journal ArticleDOI
Prospects of Thin-Film Thermoelectric Devices for Hot-Spot Cooling and On-Chip Energy Harvesting
TL;DR: In this article, the performance of thin-film thermoelectric (TE) modules integrated directly on the silicon die with those that are attached to the heat spreader of the chip package is compared.
References
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BookDOI
CRC Handbook of Thermoelectrics
TL;DR: In this article, Rowe et al. proposed a method for reducing the thermal conductivity of a thermoelectric generator by reducing the carrier concentration of the generator, which was shown to improve the generator's performance.
Journal ArticleDOI
Thermal sensors based on the seebeck effect
TL;DR: In this article, an analysis of the performance of integrated silicon thermopiles is presented and several thermal sensors that measure magnetic, mechanical, radiation and chemical signals, as well as electrical converters are reviewed.
Journal ArticleDOI
Nanoscale Thermal Transport and Microrefrigerators on a Chip
TL;DR: In this paper, a review of recent advances in nanoscale thermal and thermoelectric transport with an emphasis on the impact on integrated circuit (IC) thermal management is presented.
Nanoscale Thermal Transport and Microrefrigerators on a Chip Devices for cooling high power density and dynamic hot spots can be formed by solid-state thin films on the chip, or they could be buried in, bonded to, or mounted on substrates.
TL;DR: This paper reviews recent advances in nanoscale thermal and thermoelectric transport with an emphasis on the impact on integrated circuit (IC) thermal management and focuses on the fundamental interaction between heat and electricity, i.e., thermoeLECTric effects, and how nanostructures are used to modify this interaction.
Journal ArticleDOI
On-chip hot spot cooling using silicon thermoelectric microcoolers
Peng Wang,Avram Bar-Cohen +1 more
TL;DR: In this article, a three-dimensional analytical thermal model of the silicon chip was developed and used to predict the on-chip hot spot cooling performance, and the effects of hot spot size, hot spot heat flux, silicon chip thickness, microcooler size, doping concentration in the silicon, and parasitic Joule heating from electric contact resistance on the cooling of onchip hot spots, were investigated in detail.