Journal ArticleDOI
Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits
TLDR
In this article, small droplets of hydrofluoric acid were employed to simultaneously align many millimeter-scale chips and directly bond them to the hydrophilic bonding areas formed on the host wafers by oxide-oxide bonding.Abstract:
We have demonstrated fluidic chip self-assembly on Si wafers for fabricating three-dimensional integrated circuits. In this self-assembly technique, small droplets of hydrofluoric acid were employed to simultaneously align many millimeter-scale chips and directly bond them to the hydrophilic bonding areas formed on the host wafers by oxide–oxide bonding. The liquid surface tension enables many Si chips to be self-assembled with the highest alignment accuracy of 50 nm. In addition, many chips were tightly bonded to the hydrophilic bonding areas without applying a mechanical force after the liquid was evaporated at room temperature.read more
Citations
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Journal ArticleDOI
Using Magnetic Levitation for Three Dimensional Self-Assembly
Katherine A. Mirica,Filip Ilievski,Audrey K. Ellerbee,Sergey S. Shevkoplyas,George M. Whitesides,George M. Whitesides +5 more
TL;DR: The use of magnetic levitation (MagLev) is described to guide the self-assembly of millimeterto centimeter-scale magnetic objects, which are called “components”, into 3D assemblies and structures in a paramagnetic medium positioned in the magnetic gradient generated by NdFeB magnets.
Journal ArticleDOI
3-D Integration and Through-Silicon Vias in MEMS and Microsensors
TL;DR: The 3-D integration is also an enabling technology for hetero-integration of microelectromechanical systems (MEMS)/microsensors with different technologies, such as CMOS and optoelectronics as discussed by the authors.
Journal ArticleDOI
Fabrication of Releasable Single-Crystal Silicon–Metal Oxide Field-Effect Devices and Their Deterministic Assembly on Foreign Substrates
Hyun-Joong Chung,Tae Il Kim,Hoon Kim,Spencer A. Wells,Sung Jin Jo,Numair Ahmed,Yei Hwan Jung,Sang Min Won,Christopher A. Bower,John A. Rogers +9 more
TL;DR: In this article, a new class of thin, releasable single-crystal silicon semiconductor device is presented that enables integration of high-performance electronics on nearly any type of substrate.
Journal ArticleDOI
A first implementation of an automated reel-to-reel fluidic self-assembly machine.
TL;DR: A first automated reel-to-reel fluidic selfassembly process for macroelectronic applications and the production of a solid-state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.
Journal ArticleDOI
Surface tension-driven self-alignment
TL;DR: A broad and accessible review of the physics, material science and applications of capillary self-alignment is presented and all fundamental aspects of surface patterning and conditioning, of choice, deposition and confinement of liquids, and of component feeding and interconnection to substrates are illustrated.
References
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TL;DR: In this paper, the authors describe the rationale and development of a wafer-scale three-dimensional (3D) integrated circuit technology and the essential elements of the 3D technology are integrated circuit fabrication on silicon-on-insulator wafers, precision waferwafer alignment using an in-house developed alignment system, low-temperature wafer wafer bonding to transfer and stack active circuit layers, and interconnection of the circuit layers with dense-vertical connections with sub-Omega 3-D via resistances.
Journal ArticleDOI
High-Density Through Silicon Vias for 3-D LSIs
TL;DR: The 3-D microprocessor test chip,3-D memorytest chip, 3- D image sensor chip, and 3-Ds artificial retina chip were successfully fabricated by using poly-Si TSV and tungsten (W/poly-Si) TSV technology.