Proceedings ArticleDOI
The effect of temperature on the reliability of electronic components
Vasudevan Lakshminarayanan,Natarajan Sriraam +1 more
- pp 1-6
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TLDR
In this article, the effect of temperature on the reliability of components used in typical electronic systems is discussed with illustrative examples for reliability calculations, and it is shown that suitable methods can be applied to minimize failures of electronic components due to thermal stresses.Abstract:
Reliability of electronic systems for operating in all types of environments has become a necessity. The progressive miniaturization in electronics, packaging of a large number of active devices per unit area of the component due to higher integration levels, higher power density per unit area, need for low- cost and reliable products, and the wide range of applications in specialized commercial, avionics, underground oil exploration, automotive, and other high temperature environments besides the normal commercial applications demands a high degree of reliable operation of the electronics under harsh environmental conditions. In such situations, reliability has to be built into the system by design, choice of suitable components, packaging and cooling techniques. This paper discusses the effect of temperature on the reliability of components used in typical electronic systems. Various models based on the temperature principle are discussed with illustrative examples for reliability calculations.Further, it is shown that by using the principle of cause - effect relationship, suitable methods can be applied to minimize failures of electronic components due to thermal stresses.read more
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References
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Journal ArticleDOI
Solder joint fatigue models: review and applicability to chip scale packages
TL;DR: A review of fourteen solder joint fatigue models is presented in this article with an emphasis on summarizing the features and applications of each fatigue model, and two fatigue model application scenarios are discussed.
High-Temperature Electronics Pose Design and Reliability Challenges
Jeff Watson,Gustavo Castro +1 more
TL;DR: In some applications, cooling may not be possible, or it may be more appealing for the electronics to operate hot to improve system reliability or reduce cost as discussed by the authors, which presents challenges that affect many aspects of the electronic system, including the silicon, packaging, qualification methodology, and design techniques.