Theory of Thermal Time Constants in GaN High-Electron-Mobility Transistors
Kevin R. Bagnall,Evelyn N. Wang +1 more
TLDR
In this article, the authors present a fundamental study of the transient thermal behavior of GaN HEMTs to aid in understanding the complex contributions of multidimensional thermal spreading, multiple epitaxial layers, multiple gate fingers, and thermal boundary resistance to the temperature rise.Abstract:
Due to the high dissipated power densities present in GaN high-electron-mobility transistors (HEMTs) in high-power radio frequency applications, thermal analysis and thermal management of these devices are important in achieving their full potential. In this paper, we present a fundamental study of the transient thermal behavior of GaN HEMTs to aid in understanding the complex contributions of multidimensional thermal spreading, multiple epitaxial layers, multiple gate fingers, and thermal boundary resistance to the temperature rise. This complex behavior cannot be accurately described by one or two thermal time constants. Rather, a broad spectrum of time constants from ~1 ns up to several milliseconds are present in the device due to aggressive multidimensional thermal spreading from the narrow region of power dissipation next to each HEMT gate through the substrate, die attach, and package. In order to accurately model the temperature response, at least one time constant per decade over the timescale of interest is required. These findings are crucial in developing an intuitive understanding of the transient thermal behavior of GaN HEMTs and properly accounting for transient temperature rise in electrothermal modeling of high-power GaN-based amplifiers.read more
Citations
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Experimental Characterization of the Thermal Time Constants of GaN HEMTs Via Micro-Raman Thermometry
TL;DR: In this paper, the transient temperature rise and thermal time constant spectrum of GaN HEMTs via time-resolved micro-Raman thermometry with a temporal resolution of 30 ns were measured.
Journal ArticleDOI
Genetic algorithm initialized artificial neural network based temperature dependent small-signal modeling technique for GaN high electron mobility transistors
TL;DR: This paper explores and develops efficient temperature‐dependent small‐signal modeling approaches for GaN high electron mobility transistors (HEMTs) and shows that the cascaded MLP with GA exhibits better performance but with increased complexity.
Journal ArticleDOI
Scalable Modeling of Transient Self-Heating of GaN High-Electron-Mobility Transistors Based on Experimental Measurements
Adrien Cutivet,Georges Pavlidis,Bilal Hassan,Meriem Bouchilaoun,Christophe Rodriguez,Ali Soltani,Samuel Graham,Francois Boone,Hassan Maher +8 more
TL;DR: In this paper, an extraction procedure to fully model the transient self-heating of transistors from a GaN HEMT technology is described. But the authors focus on the thermal impedance of the transistors.
Journal ArticleDOI
Scanning thermal microscopy for accurate nanoscale device thermography
TL;DR: In this article, the accuracy and reliability of temperature mapping using scanning thermal microscopy (SThM) in contact and PeakForce tapping mode on the example of a GaN-on-SiC high electron mobility transistor (HEMT) were investigated.
Journal ArticleDOI
Thickness Dependence and Anisotropy of Capped Diamond Thermal Conductivity on Cooling of Pulse-Operated GaN HEMTs
Hang Zhang,Zhixiong Guo +1 more
TL;DR: In this paper, a capped thin-film diamond heat spreader is modeled for the reinforcement of hotspot cooling in the application of pulse-operated GaN-based high-electron mobility transistors (HEMTs).
References
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Journal ArticleDOI
Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures
Oliver Ambacher,Joseph A. Smart,James R. Shealy,Nils Weimann,K. Chu,M. J. Murphy,William J. Schaff,L.F. Eastman,Roman Dimitrov,L. Wittmer,Martin Stutzmann,W. Rieger,J. Hilsenbeck +12 more
TL;DR: In this article, the authors investigated the role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces.
Journal ArticleDOI
A Review of GaN on SiC High Electron-Mobility Power Transistors and MMICs
TL;DR: Examples of broadband amplifiers, as well as several of the main areas of high-efficiency amplifier design-notably Class-D, Class-E, class-F, and Class-J approaches, Doherty PAs, envelope-tracking techniques, and Chireix outphasing are described.
Journal ArticleDOI
Thermal Conductivity of Silicon from 300 to 1400°K
TL;DR: The thermal diffusivity of pure silicon has been measured from 300 to 1400 K and the Gruneisen constant for silicon from these high-temperature thermal conductivity measurements was 1.96, if the Debye temperature is taken as 636 K as mentioned in this paper.
Journal ArticleDOI
A new evaluation method of thermal transient measurement results
TL;DR: In this article, the authors present a new mathematical method for the evaluation of the recorded transient, which is a detailed heat-flow map of the package structure, called the structure function.
Journal Article
Thermal Conductivity of Silicon from 300 to 1400°K^*
TL;DR: The thermal diffusivity of pure silicon has been measured from 300 to 1400 degrees K and the specific heat of the same material over the same temperature range was measured by Dennison.