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Journal ArticleDOI

Thermionic trap-assisted tunneling model and its application to leakage current in nitrided oxides and AlGaN∕GaN high electron mobility transistors

D. Mahaveer Sathaiya, +1 more
- 11 May 2006 - 
- Vol. 99, Iss: 9, pp 093701
TLDR
In this paper, two models of electron tunneling from metal to a semiconductor via traps are proposed, one called generalized thermionic trap-assisted tunneling (GTTT) and the other one called thermionic trapped-assisted tunnelling (TTT).
Abstract
We propose two models of electron tunneling from metal to a semiconductor via traps. In addition to the electrons below the metal Fermi level, the models also include the thermally activated electrons above the Fermi level. The first model is called generalized thermionic trap-assisted tunneling (GTTT), which considers tunneling through both triangular and trapezoidal barriers present in metal insulator semiconductor (MIS) structures. The second model is called thermionic trap-assisted tunneling (TTT), which considers tunneling through triangular barriers present in modern Schottky junctions. The GTTT model is shown to predict the low field leakage currents in MIS structures with nitrided oxide as insulator, and the TTT model is shown to predict the reverse gate leakage in AlGaN∕GaN high electron mobility transistors.

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Citations
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Book ChapterDOI

Analog Performance of Normally-On Si3N4/AlN/β-Ga2O3 HEMT

Hajilakiie
TL;DR: In this article , the Si3N4 was used as a dielectric between gate and AlN layer to enhance the efficiency and reliability of the conventional HEMT reducing the gate leakage current and short channel effects.
Journal ArticleDOI

Off‐State Drain Leakage Current Mechanism in GaN High Electron Mobility Transistors from Thermal Storage Test

TL;DR: In this paper , the effect of thermal storage test on GaN high electron mobility transistor (HEMT) is investigated by observing off-state drain leakage current and on-state hysteresis and maximum transconductance.
Proceedings ArticleDOI

Admittance spectroscopy and capacitance dispersion of AlGaN/GaN hetero-structures

TL;DR: In this paper, the trap densities of states (D it ) of these traps were extracted in the range of ∼19×1012 eV−1cm−2 with the reverse bias voltage ranging from −5 Volts to 0 Volt.
Journal ArticleDOI

Temperature-Dependence of the Leakage Current of 3C-SiC p+-n Diodes Caused by Extended Defects

TL;DR: In this paper, a large leakage current (IR) is observed at reverse bias (VR) in 3C-SiC p+-n diodes, caused by a high density of stacking faults (SFs).
References
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Book

Metal-semiconductor contacts

TL;DR: In this article, a review of the present knowledge of metal-semiconductor contacts is given, including the factors that determine the height of the Schottky barrier, its current/voltage characteristics, and its capacitance.
Book

Properties of advanced semiconductor materials : GaN, AlN, InN, BN, SiC, SiGe

TL;DR: The Brillouin Zone for Wurtzite Crystal is defined in this paper, as the first zone for Zinc Blende Crystal, which is a type of hexagonal crystal.
Journal ArticleDOI

Mechanisms of current collapse and gate leakage currents in AlGaN/GaN heterostructure field effect transistors

TL;DR: In this paper, the authors investigated the mechanisms of drain current collapse and gate leakage currents in the AlGaN/GaN heterostructure field effect transistor (HFET), and detailed electrical properties of the ungated and Schottky-gated portion of the device were investigated separately.
Journal ArticleDOI

Gate leakage current mechanisms in AlGaN/GaN heterostructure field-effect transistors

TL;DR: In this paper, the gate leakage currents in AlGaN/GaN heterostructure field effect transistor (HFET) structures with conventional and polarization-enhanced barriers have been studied.
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