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Journal ArticleDOI

A new method to extract EOT of ultrathin gate dielectric with high leakage current

Zhijiong Luo, +1 more
- 30 Aug 2004 - 
- Vol. 25, Iss: 9, pp 655-657
TLDR
In this paper, a simple methodology based on dual-frequency C-V measurement and four-element circuit model was proposed to extract the equivalent oxide thickness (EOT) in the presence of gate leakage current and series resistance.
Abstract
The standard capacitance-voltage (C-V ) technique can no longer determine accurately the equivalent oxide thickness (EOT) for an advanced CMOS transistor with ultrathin gate dielectric where there is high gate leakage current, as well as series resistance; this situation will get worse as the CMOS transistor's scaling trend continues. This paper describes a simple methodology based on dual-frequency C-V measurement and four-element circuit model to extract accurately the EOT in the presence of gate leakage current and series resistance. This method can be effective with a current density of 1000 A/cm/sup 2/ for a 10 /spl mu/m /spl times/10 /spl mu/m capacitor. Such a high current density will satisfy the projected gate leakage current requirements for many generations of CMOS technologies, as specified in the 2003 International Technology Roadmap for Semiconductors.

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Citations
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Journal ArticleDOI

Capacitance-voltage studies on enhancement-mode InGaAs metal-oxide-semiconductor field-effect transistor using atomic-layer-deposited Al2O3 gate dielectric

TL;DR: In this article, an enhancement-mode n-channel InGaAs metaloxide-semiconductor field effect transistor is also demonstrated by forming true inversion channel at Al2O3∕InGaAs interface.
Journal ArticleDOI

Interfacial self-cleaning in atomic layer deposition of HfO2 gate dielectric on In0.15Ga0.85As

TL;DR: An interfacial self-cleaning phenomenon was found in the atomic layer deposition of HfO2 on In0.15Ga0.85As∕GaAs substrate using Hf(NCH3C2H5)4, i.e., TEMAH, and H2O as the precursors as mentioned in this paper.
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Extrinsic and Intrinsic Frequency Dispersion of High-k Materials in Capacitance-Voltage Measurements

TL;DR: The effect of the lossy interfacial layer on frequency dispersion was investigated and modeled based on a dual frequency technique and dielectric relaxation mechanisms are discussed.
Journal ArticleDOI

Dielectric relaxation of lanthanum doped zirconium oxide

TL;DR: In this paper, Lanthanum doped zirconium oxide (Lax-Zr1−xO2−δ) films, with La contents up to x=0.35, were studied.
Journal ArticleDOI

Two-frequency C-V correction using five-element circuit model for high-k gate dielectric and ultrathin oxide

TL;DR: In this article, a five-element circuit model was proposed for the two-frequency capacitance-voltage (C-V) correction of high-k gate dielectric and ultrathin oxide.
References
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Journal ArticleDOI

MOS capacitance measurements for high-leakage thin dielectrics

TL;DR: In this article, a new technique is presented which allows the frequency-independent device capacitance to be accurately extracted from impedance measurements at two frequencies for a 1.7 nm SiO/sub 2/ capacitor.
Journal ArticleDOI

Dual-frequency modified C/V technique

TL;DR: In this paper, the carrier density profile of very leaky Schottky-barrier devices is obtained by measuring the impedance as a function of applied reverse voltage for two frequencies, along with expressions for the parasitic series and shunt resistances.
Journal ArticleDOI

Effect of back contact impedance on frequency dependence of capacitance‐voltage measurements on metal/diamond diodes

TL;DR: In this paper, the authors performed differential capacitance-voltage measurements on Al and Pt rectifying contacts fabricated on natural (type IIb) diamonds and found that the frequency dependence seems primarily an effect of the contact capacitance, contact resistance, and bulk resistance of diamond.
Journal ArticleDOI

Influence of ac contact impedance on high‐frequency, low‐temperature, or fast‐transient junction measurements in semiconductors

TL;DR: In this paper, a copper-gold contact on p-type cadmium telluride is used to illustrate the influence of the ac contact impedance on standard semiconductor measurements such as capacitance versus voltage, admittance spectroscopy, and deep-level transient spectrograms.
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