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Journal ArticleDOI

Modeling of output snapback characteristics in n-channel SOI MOSFETs

J.S.T. Huang, +2 more
- 01 May 1992 - 
- Vol. 39, Iss: 5, pp 1170-1178
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TLDR
In this paper, an analytical model was developed for predicting the observed output characteristics taking into account both the bipolar and the MOS mechanisms, and it was shown that, with continuing scaling of device geometries and improvement in SOI materials, the bipolar-induced snapback will become dominant in the future.
Abstract
The snapback effect is usually observed in the output characteristics of an n-channel SOI MOSFET with zero gate voltage in which the drain-to-source breakdown voltage is less than the drain-to-body avalanche voltage. It can be attributed to parasitic lateral bipolar actions as well as the MOS feedback mode of operation-a point often overlooked in the literature. An analytical model is developed for predicting the observed output characteristics taking into account both the bipolar and the MOS mechanisms. Results obtained from this model agree well with the experimental I-V curves, and show that, with continuing scaling of device geometries and improvement in SOI materials, the bipolar-induced snapback will become dominant in the future. >

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Citations
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Journal ArticleDOI

Self-heating and kink effects in a-Si:H thin film transistors

TL;DR: In this paper, a new physics based, analytical DC model accounting for short channel effects for hydrogenated amorphous silicon (a-Si:H) thin film transistors (TFT's) is presented.
Journal ArticleDOI

A physical model of floating body thin film silicon-on-insulator nMOSFET with parasitic bipolar transistor

TL;DR: In this paper, an analytical model for SOI nMOSFET with a floating body is developed to describe the I/sub ds/-V/sub Ds/ characteristics.
Journal ArticleDOI

Double snapback in SOI nMOSFETs and its application for SOI ESD protection

TL;DR: In this article, the double-snapback phenomenon in silicon-on-insulator (SOI) nMOSFETs is investigated and a tentative model is presented.
Journal ArticleDOI

The pseudo-two-dimensional approach to model the drain section in SOI MOSFETs

TL;DR: In this paper, the authors extended the pseudo-two-dimensional (2D) approach from traditional bulk-Si devices to silicon-on-insulator (SOI) ones and discussed the benefits of pseudo-2D approach in saturation-region modeling.
Book

Modeling of Electrical Overstress in Integrated Circuits

TL;DR: In this paper, a nonlinear 2D-1D thermal simulator called ITSIM is proposed to simulate EOS thermal failure in ICs, based on a circuit level EOS simulator.
References
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Journal ArticleDOI

Ionization Rates for Electrons and Holes in Silicon

TL;DR: In this article, the ionization rates for holes and electrons in silicon have been determined over the following ranges of field: for holes, (2.5-6.0)\ifmmode\times\else\texttimes\fi{}${10}^{5}$ volts
Journal ArticleDOI

The effect of high fields on MOS device and circuit performance

TL;DR: In this article, a simple analytical model for the MOS device characteristics including the effect of high vertical and horizontal fields on channel carrier velocity is presented, and analytical expressions for the drain current, saturation drain voltage, and transconductance are developed.
Journal ArticleDOI

A simple method to characterize substrate current in MOSFET's

TL;DR: In this article, a simple relationship between substrate current and V DS - V DSAT is found, which provides a convenient tool to characterize the substrate current or the channel electric field, and hence, hence, all hot-electron effects.
Journal ArticleDOI

Single-transistor latch in SOI MOSFETs

TL;DR: In this paper, a single-transistor latch phenomenon observed in silicon-on-insulator (SOI) MOSFETs is reported, which occurs at high drain biases.
Journal ArticleDOI

Dependence of channel electric field on device scaling

TL;DR: In this article, the authors investigated the dependence of the maximum channel electric field on device geometries and process parameters, and found that E m has a form of (V{DS} - V_{DSAT})/ 0.22T
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