Numerical Simulation of Heat Transfer in a Three-Dimensional Enclosure with Three Chips in Various Position Arrangements

TLDR: In this article, the authors analyzed the three-dimensional laminar natural convection flow with three chips at various positions by employing the computational fluid dynamics (CFD) code PHOENICS.

Abstract: The three-dimensional laminar natural convection flow with three chips at various positions was analyzed by employing the computational fluid dynamics (CFD) code PHOENICS. The SIMPLEST algorithm with the Hybrid Scheme was used to simulate these flows. Three chips, arranged in five different positions with isothermal and insulated walls, were solved. The temperature distribution of our computational results was similar to the experimental data trend and very close to the numerical results achieved by Beak et al. The calculating results show that different chip position arrangements strongly influence the chip average temperature. The highest temperature occurred with the vertical chip arrangements. The findings herein establish a fundamental numerical study of three-dimensional heat transfer using three chips and a basis for further analysis of the associated heat transfer for more complicated chip position arrangements.