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Journal ArticleDOI

Recent advances in non-chemically amplified photoresists for next generation IC technology

TLDR
In this article, a review of the recent developments in the area of n-CARs for sub-30 nm node technology using next generation lithography (NGL) techniques is presented.
Abstract
While chemically amplified resists (CARs) have been dominating the semiconductor industries over the past few decades, particularly in the area of computer chip fabrication, the replacement of such resists has been realized in recent times as the CARs are approaching their resolution limit, and thus may not be able to fulfil the market demand that the semiconductor industries are looking for, particularly for sub-20 nm node technology using next generation lithography techniques. In this context, non-chemically amplified resists (n-CARs) are being anticipated as potential replacements of CARs. In the case of n-CARs, the photosensitive functionality is integrated into the resist backbone. Therefore, upon exposure to photons of suitable energy, the photosensitive group undergoes photochemical changes resulting in polarity switching between the exposed and unexposed regions. This polarity change helps in developing patterns in the presence of a suitable developer. Therefore, external chemical amplification using photoacid generators (PAGs) is not needed to bring in required polarity changes in the case of n-CARs. As the n-CARs do not require any additional chemical amplification, they are devoid of the most serious problem that almost all CARs face i.e. acid diffusion in the solid state causing considerable line-edge roughness (LER) and line-width roughness (LWR). Recently, several research groups have designed and developed various n-CARs with ultra-low resolution and LER/LWR. Although many n-CARs, sensitive to photons of various energies, have been developed over the last few decades for larger nodes (>60 nm) the n-CARs development for patterning sub-30 nm features is at the plinth level. This review article will focus on the recent developments in the area of n-CARs for sub-30 nm node technology using next generation lithography (NGL) techniques.

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Citations
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Journal ArticleDOI

Development of Nickel-Based Negative Tone Metal Oxide Cluster Resists for Sub-10 nm Electron Beam and Helium Ion Beam Lithography.

TL;DR: The Ni-MOCs based resist investigated under HIBL and EBL elucidates the ability of its potential for sub-10 nm technology node, under standard processing conditions.
Journal ArticleDOI

Chemical and structural investigation of zinc-oxo cluster photoresists for DUV lithography

TL;DR: In this article, a detailed investigation was carried out on a zinc-oxo cluster photoresist combined with deep ultraviolet (DUV) lithography, showing the impact of both DUV irradiation and thermal treatment on material patterning.
Journal ArticleDOI

Polyarylenesulfonium Salt as a Novel and Versatile Nonchemically Amplified Negative Tone Photoresist for High-Resolution Extreme Ultraviolet Lithography Applications

TL;DR: Polyarylenesulfonium polymer, PAS, as a versatile nonchemically amplified negative tone photoresist for next-generation lithography (NGL) applications starting from i-line to extreme ultraviolet (EUV, λ ∼ 13.5 nm) lithography.
Journal ArticleDOI

Organotin in Nonchemically Amplified Polymeric Hybrid Resist Imparts Better Resolution with Sensitivity for Next-Generation Lithography

TL;DR: In this paper, the need for a next-generation technology node in the area of integrated circuits (ICs), improvement in the properties of resist materials, particularly sensitivity (ED), resolution, and good etc.
Journal ArticleDOI

EUV photofragmentation study of hybrid nonchemically amplified resists containing antimony as an absorption enhancer

TL;DR: In this article, the photodynamics of a hybrid nonchemically amplified 2.15%-MAPDSA-MAPDST resist using synchrotron radiation excitation at 103.5 eV (12 nm) is presented.
References
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Journal ArticleDOI

Applications of advanced hybrid organic–inorganic nanomaterials: from laboratory to market

TL;DR: The description and discussion of the major applications of hybrid inorganic-organic (or biologic) materials are the major topic of this critical review.
Journal ArticleDOI

Resists for sub-20-nm electron beam lithography with a focus on HSQ: state of the art.

TL;DR: An overview of the best resolution obtained with several types of both organic and inorganic resists, including hydrogen silsesquioxane (HSQ), which is a relatively new e-beam resist that is very suitable when aiming for sub-20-nm resolution.
Journal Article

Chemical amplification resists for microlithography

TL;DR: This chapter describes polymers employed in formulation of chemically amplified resists for microlithography, which have become the workhorse in device manufacturing for the last few years and are continuing to be imaging materials of choice for a few more generations.
Journal ArticleDOI

Three-dimensional siloxane resist for the formation of nanopatterns with minimum linewidth fluctuations

TL;DR: In this paper, the authors evaluate hydrogen silsesquioxane (HSQ) with a three-dimensional framework from the standpoints of resist patterning and its ability to reduce linewidth fluctuation.
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This polarity change helps in developing patterns in the presence of a suitable developer.