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Proceedings ArticleDOI

Stacked gate dielectrics with TaO for future CMOS technologies

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TLDR
In this article, a SiO/sub 2/Ta/Sub 2/O/Sub 5/SiO/ Sub 2/ O/sub 5/ stacked dielectric was proposed to solve the problem of high interface trap states and low silicon interface carrier mobility.
Abstract
Summary form only given. Advances in lithography and thinner SiO/sub 2/ gate oxides have enabled the scaling of MOS (metal-oxide-semiconductor) technologies to sub-0.25 /spl mu/m feature size. High dielectric constant materials, such as Ta/sub 2/O/sub 5/, have been suggested as a substitute for SiO/sub 2/ as the gate material beyond t/sub ox/=25 /spl Aring/. However, the Si-Ta/sub 2/O/sub 5/ material system suffers from unacceptable levels of bulk fixed charge, high density of interface trap states, and low silicon interface carrier mobility. We present a solution to these issues through the synthesis of a SiO/sub 2/-Ta/sub 2/O/sub 5/-SiO/sub 2/ stacked dielectric. The fabricated transistors exhibit excellent I-V characteristics.

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Citations
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The future of wires

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The impact of high-/spl kappa/ gate dielectrics and metal gate electrodes on sub-100 nm MOSFETs

TL;DR: In this paper, the potential impact of high/spl kappa/ gate dielectrics on device short-channel performance is studied over a wide range of dielectric permittivities using a two-dimensional (2D) simulator implemented with quantum mechanical models.
Proceedings ArticleDOI

CMOS metal replacement gate transistors using tantalum pentoxide gate insulator

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Patent

MOS-type semiconductor device and method for making same

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Journal ArticleDOI

Improvement of threshold voltage deviation in damascene metal gate transistors

TL;DR: In this paper, the work function deviation (crystal orientation deviation) was found to cause the threshold voltage deviation (/spl Delta/V/sub th/) in the damascene metal gate transistors.
References
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Journal ArticleDOI

Fabrication and characterization of Si-MOSFET's with PECVD amorphous Ta 2 O 5 gate insulator

TL;DR: In this article, a p-channel Al gate transistor with amorphous Ta/sub 2/O/sub 5/ insulator gates was fabricated using a low pressure (a few mtorr) plasma-enhanced CVD process in a microwave (2.45 GHz) excited electron cyclotron resonance reactor.
Journal ArticleDOI

High electric fields in silicon dioxide produced by corona charging

TL;DR: In this article, high electric fields were applied to films of SiO2 thermally grown on silicon, and the surface potential was measured using a vibrating capacitor plate mounted near the free surface.
Journal ArticleDOI

Reduction of current leakage in chemical-vapor deposited Ta 2 O 5 thin-films by oxygen-radical annealing [DRAM dielectric]

TL;DR: In this paper, the electrical properties of CVD-Ta/sub 2/O/sub 5/ thin-films are improved by post-deposition oxygen-radical annealing.
Proceedings ArticleDOI

Ultra-thin Ta/sub 2/O/sub 5/SiO/sub 2/ gate insulator with TiN gate technology for 0.1/spl mu/m MOSFETs

TL;DR: Ta205/Si02 gate insulator with a TIN gate electrode technology was proposed in this paper, which achieved high drive current and stable operation for the first time by using a poly-Si electrode.
Journal ArticleDOI

Current drive enhancement by using high-permittivity gate insulator in SOI MOSFET's and its limitation

TL;DR: In this paper, speed enhancement effects by using a high-permittivity gate insulator in SOI MOSFETs and its limitation were investigated by a two-dimensional device simulator and circuit simulator.
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The fabricated transistors exhibit excellent I-V characteristics.