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Journal ArticleDOI

Whole-chip ESD protection design with efficient VDD-to-VSS ESD clamp circuits for submicron CMOS VLSI

Ming-Dou Ker
- 01 Jan 1999 - 
- Vol. 46, Iss: 1, pp 173-183
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TLDR
In this paper, a whole-chip ESD protection design with efficient VDD-to-VSS ESD clamp circuits is proposed to provide a real whole chip ESDprotection for submicron CMOS IC's without causing unexpected ESD damage in the internal circuits.
Abstract
A whole-chip ESD protection design with efficient VDD-to-VSS ESD clamp circuits is proposed to provide a real whole-chip ESD protection for submicron CMOS IC's without causing unexpected ESD damage in the internal circuits. The efficient VDD-to-VSS ESD clamp circuit has been designed to provide a low-impedance path between the VDD and VSS power lines of the IC during the ESD-stress condition, but this ESD clamp circuit is kept off when the IC is under its normal operating condition. Due to the parasitic resistance and capacitance along the VDD and VSS power lines, the ESD-protection efficiency is dependent on the pin location on a chip. Therefore, an experimental test chip has been designed and fabricated to build up a special ESD design rule for whole-chip ESD protection in a 0.8-/spl mu/m CMOS technology. This whole-chip ESD protection design has been practically used to rescue a 0.8-/spl mu/m CMOS IC product with a pin-to-pin HBM ESD level from the original level of 0.5 kV to become above 3 kV.

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Citations
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Journal ArticleDOI

ESD Protection Design for Open-Drain Power Amplifier in CMOS Technology

TL;DR: In this article, an on-chip electrostatic discharge (ESD) protection device for radiofrequency (RF) power amplifier (PA) with open-drain structure is studied in silicon and applied to the 2.4GHz PAs.
Journal ArticleDOI

Investigation on NMOS-based power-rail ESD clamp circuits with gate-driven mechanism in a 0.13-μm CMOS technology

TL;DR: Among the NMOS-based power-rail ESD clamp circuits, an abnormal latch- on event has been observed under the EFT test and fast power-on condition and the root cause of this latch-on failure mechanism has been clearly explained by the emission microscope with InGaAs FPA detector.
Journal ArticleDOI

Surface engineering and on-site charge neutralization for the regulation of contact electrification

TL;DR: In this article , a new post-treatment antistatic strategy is demonstrated to significantly reduce the accumulation of static charge by controlling the spatial distribution of tribopositive and tribonegative regions.
Proceedings ArticleDOI

A transponder IC for wireless auto identification system

TL;DR: A batteryless, self-powered transponder used in the wireless auto identification system is proposed in this paper, which works in a frequency of 915MHz and has three phases: analog part, digital part and memory part.
Proceedings ArticleDOI

Active ESD protection for input transistors in a 40-nm CMOS process

TL;DR: By replacing the protection resistor with an active switch that isolates the input transistors from the pad under ESD stress, the ESD robustness can be greatly improved.
References
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Journal ArticleDOI

The impact of technology scaling on ESD robustness and protection circuit design

TL;DR: In this paper, the trend in ESD robustness as a function of technology scaling, for feature sizes down to 0.25 /spl mu/m, have been experimentally determined using single finger nMOS transistors and full ESD protection circuits.
Proceedings ArticleDOI

Dynamic gate coupling of NMOS for efficient output ESD protection

TL;DR: In this article, a dynamic gate coupling effect that increases the electrostatic discharge (ESD) protection efficiency of NMOS output devices is reported and the design issues for optimum output ESD protection are also discussed.
Proceedings ArticleDOI

Sub-micron chip ESD protection schemes which avoid avalanching junctions

TL;DR: In this article, an array of ESD protection methods have been developed and tested which depend on forward biased diodes and normal MOSFET conduction, which result in parts made in 0.8 and 0.6 /spl mu/m salicided technologies routinely passing their upper division spec. of /spl plusmn/4500 V HBM without any discernible increase in pin leakage.
Proceedings ArticleDOI

Novel clamp circuits for IC power supply protection

TL;DR: In this article, the p-n-p transistor chains are made from floating n-wells in p-substrate CMOS and used for power supply ESD clamps.
Journal ArticleDOI

Internal chip ESD phenomena beyond the protection circuit

TL;DR: In this paper, the issues of protection between V/sub DD/ and V/ sub SS/ are discussed and examples of how protection circuit performance can be sensitive to internal chip layout, independent of its effective design.