Finisar

About: Finisar is a company organization based out in Sunnyvale, California, United States. It is known for research contribution in the topics: Signal & Laser. The organization has 900 authors who have published 1523 publications receiving 22634 citations.

Printed circuit boards for use in optical transceivers

Abstract: One example of an optical transceiver includes a housing and an optical transmitter and optical receiver disposed within the housing. A PCB is also disposed in the housing. The PCB has front and side edges, as well as circuitry in communication with the optical transmitter and the optical receiver. The PCB also includes a group of plated contact pads, each of which includes a front-most extremity that terminates short of the front edge. Finally, the PCB includes a group of traces, one of which leads from one of the side edges of the PCB to a via that is connected with the circuitry, and another of which leads from the via to one of the plated contact pads.

Data communication using multiple channels

Abstract: A method of transmitting data may include receiving feedback information that includes effective channel bandwidths, signal-to-noise ratios (SNRs) associated with multiple optical channels on an optical link, and individual SNRs associated with subcarriers on each optical channel. The method may include determining multiple subcarrier power allocation schemes based on the feedback information. Each subcarrier power allocation scheme may be associated with a corresponding optical channel from the multiple optical channels and may be configured to allocate a signal power among subcarriers configured to transmit on the corresponding optical channel. The method may include determining, based on the feedback information, an optical power allocation scheme configured to allocate an optical power among the multiple optical channels. The method may include transmitting data on the multiple optical channels based on the multiple subcarrier power allocation schemes and the optical power allocation scheme.

Self-testing optical transceiver controller using internalized loopbacks

Abstract: An operational optical transceiver microcontroller configured to initiate a self-test using internalized loop backs. The microcontroller includes a memory, at least one processor and a number of input and output terminals. The output terminals are coupled to internally corresponding input terminals by a configurable switch. The memory receives microcode that, when executed by the processor, causes the microcontroller to close the switches so as to internally connect the output and input terminals. A signal is then asserted on the output terminal. This signal loops back and is received by the input terminal. The processor may then detect the microcontroller's response to the signal.

Method for calibrating an optoelectronic device based on APD breakdown voltage

Abstract: Methods and processes are disclosed for calibrating optoelectronic devices, such as optoelectronic transceivers and optoelectronic receivers, based upon an avalanche photodiode breakdown voltage. In general, the method involves adjusting a reverse-bias voltage of the avalanche photodiode until avalanche breakdown of the avalanche photodiode occurs. An optimized APD reverse-bias voltage is then determined by reducing the reverse-bias voltage at which avalanche breakdown occurs by a predetermined offset voltage. This process is performed at a variety of different temperatures. Information concerning each temperature and the corresponding optimized APD reverse-bias voltage is stored in a memory of the optoelectronic device.

Insertable EMI shield clip for use in optical transceiver modules

Abstract: The embodiments disclosed herein relate an insertable shield clip for use in controlling electromagnetic interference in an optical transceiver module. The optical transceiver module may include a shell that houses first and second optical subassemblies and an enclosure that cooperates with the shell in defining a covering for the optical transceiver module. The shield clip may comprise a body composed of conductive material. The body may include first and second vertical side members. The body may also include first and second shield members that are each configured to receive a corresponding nosepiece of one of the first and second optical subassemblies. The body may further include a bottom member that interconnects the first and second vertical side members and the first and second shield members.