Finisar

About: Finisar is a company organization based out in Sunnyvale, California, United States. It is known for research contribution in the topics: Signal & Laser. The organization has 900 authors who have published 1523 publications receiving 22634 citations.

Intelligent pluggable transceiver stick capable of diagnostic monitoring and optical network management

Abstract: An integrated optical transceiver includes an optical subassembly that produces a first electrical signal in response to a first optical signal comprising reception signal data and to emit a second optical signal comprising transmission signal data in response to a second electrical signal. A data processing unit can extract the reception signal data from the first electrical signal and produce the second electrical signal in response to a third electrical signal comprising the transmission signal data. The data processing unit can perform system-layer functions. A data path interface can send the reception data to a host device and receive the third electrical signal comprising the transmission data from the host device. A management unit can control the data processing unit to perform the system-layer functions. A control path interface communicates with the management unit and the host device.

Wide temperature range vertical cavity surface emitting laser

Abstract: A vertical cavity surface emitting laser (VCSEL) module that is configured to operate in a wide temperature range without severely minimizing its lifetime or requiring excessive drive current. The VCSEL portion of the VCSEL module is tuned to operate efficiently at a higher than normal temperature. In addition to the VCSEL, the VCSEL module includes a heater and a temperature sensor that are used to maintain a particular minimum temperature that is within the efficient operation range of the VCSEL. By maintaining a temperature that is within the efficient operation range, the VCSEL module reduces the current required to operate the VCSEL and extends the overall lifetime of the VCSEL. The additional components of the VCSEL module do not interfere in any way with the signal quality produced by the VCSEL.

Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly

Abstract: An improved monitoring and control system for a laser (3034) in a header assembly (3020) of a transmitter optical subassembly (TOSA 3000). The system including one or more monitor photodiodes (MPD 4000) is positioned together with the laser on a component submount (3033). The submount in turn is mated with a multi-layer platfom (MLP 3030) that forms part of the header assembly. The MLP hermetically extends through the header assembly to provide a plurality of electrical interconnects for the laser, MPD(s), and other submount components.

Scalable network attached storage (NAS) testing tool

Abstract: Embodiments of the present invention generally provide a system and method for testing integrity of data transmitted across a network connection. In one embodiment, the method generally includes creating one or more test threads on one or more test clients attached to a server through the network connection. The method further includes, for each test thread, generating a data load on the data connection by repetitively writing test data patterns to a common data file on the server, reading data patterns from the common data file, and comparing the data patterns read from the common data file to the test data patterns written to the common data file to detect data corruptions. The method may further include measuring data throughput between the one or more test clients and the server and generating debug information if a data corruption is detected by one of the test threads.

High density array of optical transceiver modules

Abstract: Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.