Finisar

About: Finisar is a company organization based out in Sunnyvale, California, United States. It is known for research contribution in the topics: Signal & Laser. The organization has 900 authors who have published 1523 publications receiving 22634 citations.

Temperature insensitive vertical cavity surface emitting laser

Abstract: A vertical cavity surface emitting laser with temperature insensitive threshold current is constructed with a peak gain at a predetermined wavelength and with a Fabry-Perot resonance at a wavelength higher than the predetermined wavelength of the peak gain. As operating temperatures rise the peak gain is reduced but the Fabry-Perot mode moves closer to the peak gain to maintain the current substantially constant.

Optical transceiver interface for multimode fibers

Abstract: Systems and devices using diffractive and optionally refractive elements to launch an optical signal with a controlled amplitude and phase distribution into a multimode optical fiber for improved modal dispersion are provided. More particularly, optical ports, transmitter optical subassemblies (TOSAs), and transceivers use integrated diffractive and optionally refractive elements to launch a helically propagating light distribution, also known as a vortex launch. One embodiment includes a monolithic transparent port that generally includes: a lens on a first surface for receiving and collimating or focusing an optical signal; and a diffractive surface pattern for receiving the optical signal from the lens and launching the optical signal into a multimode optical fiber with a controlled intensity and phase distribution. Alternatively, the lens can be added as a separated component or omitted altogether while the diffractive surface pattern is formed on either the laser or fiber receptacle sides of the port.

Devices for preventing lens contamination in optoelectronic modules and connectors

Abstract: Embodiments of the present invention provide devices designed to protect the functional components of optoelectronic devices and connectors from damage. Some embodiments of the present invention provide removable plugs for various types of optoelectronic modules. Each of these plugs can include a base having two spaced apart insertion members extending from the base. Each of said insertion members can include a recess insertable within a port of the module and a coplanar first surface with at least one stepped portion extending from the coplanar first surface. The stepped portions can be sized and configured to snugly fit within corresponding structures in the modules, thus preventing debris contamination. Additional embodiments of the present invention provide end caps that protect various types of fiber optic connectors.

Otpical mux/demux

Abstract: A method and apparatus for multiplexing/de-multiplexing optical signals, comprising of a linear polarizer (450, fig. 4c), wave plates (452, fig. 4c), and a beam displacer/combiner (454, fig. 4c), wherein the wave plates (340, 342, 344, 346, fig. 4c) optically coupled to the linear polarizer (400, 402, 404, AB, fig. 4c), and the wave plates rotate both odd and even channel components of an optical beam between a linear and an orthogonal relationship depending on the propagation direction, and each of wave plate is of a selected length and index of refraction which together determine a free spectral range which corrresponds to a spacing between adjacent gridlines of a selected wavelength grid, and each of the wave plates is tuned to even symmetry with the selected wavelength grid and wherein the beam displacer/combiner (420, AB, 422 AB, 426, 428, FIG. 4c) displaces and combines orthogonally polarized odd and even channel components of an optical beam depending on a propagation direction.

Backside alignment and packaging of opto-electronic devices

Abstract: A die having at least one opto-electronic device disposed on a front-side of the die has its backside mounted to a submount with the backside positioned to align the front-side opto-electronic devices with respect to the submount. A first set of alignment features are formed on the backside of the die which are aligned to the front-side. The first set of a alignment features is then aligned to a second set of alignment features disposed on the submount and the backside is bounded into place.