Showing papers in "Microelectronic Engineering in 2000"

TL;DR: In this article, the viscous flow of thin PMMA films into microcavities during hot embossing has been investigated in order to optimise the molding process for nanostructured surfaces.

TL;DR: In this article, it was shown that it is possible to fabricate nanostructures with a replication fidelity of 25 nanometers with both hot embossing and injection molding.

TL;DR: In this paper, the authors describe the process of deep x-ray lithography using epoxy negative photoresist SU-8 and characterise the resist, softbake, exposure, post exposure bake, and development of the resist.

TL;DR: In this article, a modified NIL-technique for the fabrication of nm-structures is presented, based on the photopolymerization of special resits through a quartz mold.

TL;DR: In this article, a shadow mask evaporation technique for single-layer material patterning is described, which does not involve photoresist processing steps and is therefore applicable on arbitrary surfaces.

TL;DR: The design and applications of asynchronous circuits are introduced and it is shown that asynchronous logic may appear to be a key technology for the design of future telecommunication applications.

TL;DR: In this article, Electroless deposited Co(W,P) thin films were evaluated as diffusion barriers for copper metallization and showed that 30-nm-thick films can function as effective barriers against copper diffusion after thermal treatments up to 500°C.

TL;DR: In this paper, the influence of slurry chemistry and thickness of the copper layer on dishing is discussed and the experimental results lead to the following hypothesis for the Cu removal and surface passivation: the oxidizer reacts with Cu in an acidic slurry and Cu2+ ions are formed.

TL;DR: In this paper, a plano-convex microlens array with continuous relief for refractive and diffractive usage by focused ion beam (FIB) technology is introduced in detail.

TL;DR: In this paper, a complete nanobiosensor structure consisting of a 200mm x 200mm area containing 100 nm sized interdigitated nanoelectrodes with varied interelectrode distances has been fabricated using nanoimprint lithography (NIL) in combination with UV-lithography.

TL;DR: In this article, the effect of native oxide on the formation of Ni silicides was carried out, where Ni films of various thickness were sputter deposited on Si wafer without oxide, with native oxide and with oxide grown by rapid thermal oxidation, and subjected to rapid thermal annealing in nitrogen ambient for 1 min at temperatures ranging from 250 to 900°C.

TL;DR: In this paper, a fully Si-compatible process was developed to manufacture 6-inch silicon wafers with patterns of trenches, several hundreds of @mm deep with a width and pitch of a few @mm.

TL;DR: In this article, the fabrication of micro-sensors for NMR-spectroscopy on both glass and GaAs is presented, where planar coils with inner diameter from 50 μm to 400 μm including a coplanar waveguide leading to the bonding pads are combined with a chamber for liquid samples of 200-500 μm diameter on the backside of the substrate.

TL;DR: In this article, a new copper plating bath for electroless deposition directly on conductive copper-diffusion barrier layers has been developed, which can be operated at temperatures between 20 and 50°C and has good stability.

TL;DR: In this paper, a laser-plasma soft-x-ray source based on a cryogenic-xenon liquid-jet target was proposed for extreme ultraviolet (EUV) projection lithography and proximity x-ray lithography.

TL;DR: In this article, resistivity measurements and composition analysis of electron beam induced deposition (EBID) with two novel inorganic carbon-free precursors [RhCl(PF"3)"2]"2 (CAS 14876-98-3) and AuCl((PF)"3)"3)(CAS 141845-34-3), were compared with results obtained from metallorganic CVD precurors Me"2?Au-tfa (CASS 63470-53-1) and Me" 2?Aou-t

TL;DR: In this paper, a spray pyrolysis method using CdCl 2 and H 2 NCSNH 2 solutions at a substrate temperature of 310°C was used to produce CdS thin films.

TL;DR: In this paper, thin films of ZnO were deposited by thermal decomposition of the Zn(C 5 H 7 O 2 ) 2 on semiconductor substrate, n-type silicon, p-type InP and also on transparent glass substrate.

TL;DR: In this article, the use of electron beam lithography (EBL) techniques to produce novel diffractive optical microstructures for use as anti-counterfeiting devices is discussed.

TL;DR: In this article, the authors proposed a method for determining the proximity effect parameters and the shape bias parameter concurrently, and demonstrated the accuracy of the parameters, and the variation of CD errors for Lines and Spaces (L&S) patterns with PEC is less than 4% using the obtained parameters.

TL;DR: In this article, a gray-tone mask for microlens array has been fabricated and printed by a g-line stepper, where nonlinear effects in aerial image and resist development have been taken into account to correct the mask design.

TL;DR: In this paper, the effect of nitrogen content on electronic energy bands of Ga 1− x In x N y As 1− y alloys lattice matched to GaAs in the zinc-blend structure has been investigated.

TL;DR: Aromatic polymers based on methacrylates (linear polymers) and multifunctional allylesters (crosslinked polymers), have been prepared and the thermal stability of imprinted patterns has been investigated for both, linear and crosslinked aromatic polymers as mentioned in this paper.

TL;DR: In this article, a heated tungsten filament was used to cataltyze the gas phase etching of crystalline silicon with hydrogen at a substrate temperature of 200°C for obtaining plasma and contamination free etching.

TL;DR: In this paper, a tri-layer system was proposed to improve the process latitude of nano-imprint lithography by hot empossing the top layer polymer and separating the bottom layer with a 10 nm thick germanium.

TL;DR: The absorption spectra in the vacuum ultraviolet region of the spectrum from 140 to 200 nm, of various Si-based polymers and polymeric materials with aliphatic and aromatic structure for 157nm lithographic applications are discussed in this article.

TL;DR: The challenges to MEMS progress are many, extending all the way from needs for more knowledge of fundamentals to learning a great deal more about materials, processes, and system design as well as about compatibility, reliability, and interfacing.

TL;DR: In this paper, the structure, optical and photoelectric properties of amorphous Se x Te 1− x thin film alloys prepared by thermal evaporation were analyzed using Raman spectroscopy, optical transmission and two-point probe photoconductivity measurements.

TL;DR: In this paper, an anodizing technique was used to form an interlevel alumina insulator for multilevel aluminum metallization, which demonstrated good chemical and thermal stability, excellent adhesion to underlying and top layers.

TL;DR: In this article, the fabrication and characteristics of a magnetically actuated micromechanical scanner/stage with five degrees of freedom (X,Y,Z, and tilt about the X and Y axes) are presented.