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Proceedings ArticleDOI

A Microscopic Understanding of Nanometer Scale DENMOS Failure Mechanism under ESD Conditions

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TLDR
In this paper, an analysis of irreversible snapback caused due to the regenerative n-p-n turn-on in a DENMOS through a critical understanding of "thermal runaway" under ESD conditions is presented.
Abstract
We present for the first time, analysis of irreversible snapback caused due to the regenerative n-p-n turn-on in a DENMOS through a critical understanding of 'thermal runaway' under ESD conditions. The estimated It2 value from transient simulations has been correlated with the quasi-steady TLP data. A new regenerative bipolar turn-on induced failure model has been proposed and corroborated with experimental observations and failure analysis. We have also investigated the current crowding mechanism to understand the improvement in It2 value under gate and substrate biasing.

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Journal ArticleDOI

Part I: High-Voltage MOS Device Design for Improved Static and RF Performance

TL;DR: In this paper, the key design parameters of a shallow trench isolation-based drain-extended MOS transistor are discussed for RF power applications in advanced CMOS technologies, and the tradeoff between various dc and RF figures of merit (FoMs) is carefully studied using well-calibrated TCAD simulations.
Journal ArticleDOI

Off-State Degradation of High-Voltage-Tolerant nLDMOS-SCR ESD Devices

TL;DR: In this paper, the off-state degradation of n-channel laterally diffused metal-oxide-semiconductor (MOS) silicon-controlled-rectifier electrostatic discharge (ESD) devices for high-voltage applications in standard lowvoltage complementary MOS technology is studied.
Proceedings ArticleDOI

Engineering optimal high current characteristics of high voltage DENMOS

TL;DR: In this article, the improvement in ESD performance of HV DENMOS and LDMOS obtained by using selective drain extension silicide blocking (SBLK) was demonstrated through 3D TCAD and TLP measurements.
Proceedings ArticleDOI

Novel area-efficient techniques for improving ESD performance of Drain extended transistors

TL;DR: In this article, the authors demonstrate that isolated DEMOS devices are also vulnerable to failures induced by the parasitic NPN to isolation due to insufficient body resistance and demonstrate the effectiveness of using selectively SBLKed drain fingers to enable self protection.
Proceedings ArticleDOI

Physical Insights into the ESD behavior of Drain Extended FinFETs

TL;DR: In this article, the physical insights of Drain Extended FinFET under ESD stress condition are explored, and key features like bipolar triggering, conductivity modulation and localized hot spot formation pertaining to DeFinFET failure mechanism are discussed comprehensively.
References
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Journal ArticleDOI

Avalanche injection and second breakdown in transistors

TL;DR: In this paper, it was shown that transistors having thin, lightly doped collector regions are particularly susceptible to avalanche injection, which suggests that some compromise may be necessary in the design of high-frequency power transistors.
Journal ArticleDOI

Analysis of nonuniform ESD current distribution in deep submicron NMOS transistors

TL;DR: In this paper, a detailed study of the nonuniform bipolar conduction phenomenon under electrostatic discharge (ESD) events in single-finger NMOS transistors is presented, and its implications for the design of ESD protection for deep-submicron CMOS technologies are analyzed.
Journal ArticleDOI

Moving current filaments in integrated DMOS transistors under short-duration current stress

TL;DR: In this article, the authors studied the influence of termination layout of the source field on the hot-spot dynamics and discussed conditions for filament motion under non-destructive snap-back conditions, which help homogenize the time averaged current density distribution and enhance the device robustness against electrostatic discharges.
Journal ArticleDOI

A new numerical and experimental analysis tool for ESD devices by means of the transient interferometric technique

TL;DR: In this article, two different protection diodes are investigated with electrothermal simulation and transient interferometric thermal mapping experiments in a new complementary approach, and the prediction capability of the simulation tool is validated up to the thermal failure of the p-n junction.

A New Numerical and Experimental Analysis Tool for ESD Devices by Means of the Transient

TL;DR: In this article, two different protection diodes are investigated with electrothermal simulation and transient interferometric thermal-mapping experiments in a new complementary approach, and the prediction capability of the simulation tool is validated up to the thermal failure of the p-n junction.
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