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Open AccessJournal ArticleDOI

Directly modulated buried heterostructure DFB laser on SiO₂/Si substrate fabricated by regrowth of InP using bonded active layer.

TLDR
The fabrication method is a promising way to fabricate high-efficiency lasers at a low cost and the use of a lateral current injection structure is important for forming a p-i-n junction using bonded thin film.
Abstract
We describe the growth of InP layer using an ultrathin III-V active layer that is directly bonded to SiO₂/Si substrate to fabricate a buried heterostructure (BH) laser. Using a 250-nm-thick bonded active layer, we succeeded in fabricating a BH distributed feedback (DFB) laser on SiO₂/Si substrate. The use of a lateral current injection structure is important for forming a p-i-n junction using bonded thin film. The fabricated DFB laser is directly modulated by a 25.8-Gbit/s NRZ signal at 50°C. These results indicate that our fabrication method is a promising way to fabricate high-efficiency lasers at a low cost.

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Citations
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Journal ArticleDOI

Hybrid indium phosphide-on-silicon nanolaser diode

TL;DR: In this article, an ultra-compact indium phosphide-on-silicon laser diode with low current threshold, high wall-plug efficiency and high integrability is demonstrated.
Journal ArticleDOI

Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications

TL;DR: It is shown that photonic technologies have the potential to meet the requirements for selected HPC and DC applications in a shorter term, and that plasmonic interconnect modules could offer ultra-compact active areas, leading to high integration bandwidth densities, and low device capacitances allowing for ultra-high bandwidth operation that would satisfy the application requirements further into the future.
Journal ArticleDOI

Heterogeneous Silicon/III–V Semiconductor Optical Amplifiers

TL;DR: In this article, high output power and high gain semiconductor optical amplifiers integrated on a heterogeneous silicon/III-V photonics platform have been reported for a wide range of photonic integrated circuits.
Journal ArticleDOI

Silicon and hybrid silicon photonic devices for intra-datacenter applications: state of the art and perspectives [Invited]

TL;DR: A wavelength-division-multiplexing (WDM)-based optical interconnect for intra-datacenter applications is proposed and several large challenges and problems for silicon and hybrid silicon photonics to meet for interconnects in datacenters are outlined and proposed.
References
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Journal ArticleDOI

Device Requirements for Optical Interconnects to Silicon Chips

TL;DR: The current performance and future demands of interconnects to and on silicon chips are examined and the requirements for optoelectronic and optical devices are project if optics is to solve the major problems of interConnects for future high-performance silicon chips.
Journal ArticleDOI

Surface-emitting laser-its birth and generation of new optoelectronics field

TL;DR: In this article, the progress of the surface emitting laser and the vertical-cavity surface-emitting laser (VCSEL), covering the spectral band from infrared to ultraviolet by featuring its physics, materials, fabrication technology, and performances, such as threshold, output powers, polarizations, linewidth, modulation, reliability, and so on.
Journal ArticleDOI

Low loss mode size converter from 0.3 [micro sign]m square Si wire waveguides to singlemode fibres

TL;DR: In this article, a novel integrated mode size converter for single-mode Si wire waveguides is presented, which is constructed with two-dimensional tapered Si waveguide and overlaid high-index polymer waveguide.
Journal ArticleDOI

High-speed ultracompact buried heterostructure photonic-crystal laser with 13 fJ of energy consumed per bit transmitted

TL;DR: In this article, an ultracompact InP/InGaAsP buried heterostructure photonic-crystal laser with high-speed direct modulation (3-dB modulation bandwidth of 5.5 GHz) was demonstrated at room temperature by optical pumping.
Journal ArticleDOI

Hybrid Integrated Platforms for Silicon Photonics

TL;DR: A review of recent progress in hybrid integrated platforms for silicon photonics is presented in this paper, where integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other using an organic bonding agent.
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