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Journal ArticleDOI

Piezoelectric-on-Silicon Lateral Bulk Acoustic Wave Micromechanical Resonators

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TLDR
In this article, the design, fabrication, and characterization of piezoelectrically-transduced micromechanical single-crystal-silicon resonators operating in their lateral bulk acoustic modes to address the need for high-Q microelectronic-integrable frequency-selective components is presented.
Abstract
This paper reports on the design, fabrication, and characterization of piezoelectrically-transduced micromechanical single-crystal-silicon resonators operating in their lateral bulk acoustic modes to address the need for high-Q microelectronic-integrable frequency-selective components. A simple electromechanical model for optimizing performance is presented. For verification, resonators were fabricated on 5-mum-thick silicon-on- insulator substrates and use a 0.3-mum zinc oxide film for transduction. A bulk acoustic mode was observed from a 240 mum times 40 mum resonator with a 600-Omega impedance (Q=3400 at P=1 atm) at 90 MHz. A linear resonator absorbed power of -0.5 dBm and an output current of 1.3 mA rms were measured. The same device also exhibited a Q of 12 000 in its fundamental extensional mode at a pressure of 5 torr.

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Study of the Performance Enhancement of Sc-Doped AlN Super High Frequency Cross-Sectional Lamé Mode Resonators

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A Wide-Dynamic Range (-40 °C to 180 °C) Active Wireless MEMS Temperature Sensor With 7m °C Sensitivity

- 01 May 2023 - 
TL;DR: In this paper , the authors demonstrate a temperature sensor with the largest reported dynamic range (40 °C to 180 °C) among active MEMS temperature sensors using an innovative frequency shift keying (FSK) 900-MHz direct upconversion transmitter.

Piezoelectric-on-silicon latera bination of etched-slots and conv

TL;DR: In this paper, the quality factor of thin film piezoelec (TPoS) MEMS resonators through engineeri modes was improved by considering the effec slots and convex curving of the resonator ed anchor loss.
References
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Book

Fundamentals of microfabrication

TL;DR: The second edition of the Fundamentals of Microfabrication as discussed by the authors provides an in-depth coverage of the science of miniaturization, its methods, and materials, from the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering.
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Thin Film Piezoelectrics for MEMS

TL;DR: In this article, the authors reviewed the literature in this field, with an emphasis on the factors that impact the magnitude of the available piezoelectric response for non-ferroelectric materials such as ZnO and AlN.
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MEMS technology for timing and frequency control

TL;DR: As vibrating RF MEMS devices are perceived more as circuit building blocks than as stand-alone devices, and as the frequency processing circuits they enable become larger and more complex, the makings of an integrated micromechanical circuit technology begin to take shape, perhaps with a functional breadth not unlike that of integrated transistor circuits.
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Nonlinear limits for single-crystal silicon microresonators

TL;DR: In this article, the authors analyzed the nonlinear effects of single-crystal silicon micro-resonators with the focus on mechanical nonlinearities and showed that the higher energy density attainable with the silicon resonators can partially compensate for the small microresonator size.
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Thin film resonator technology

TL;DR: In this article, the development of the thin-film resonator technology and the core elements that give rise to resonators and filters for today's high performance wireless applications are surveyed.
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