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Journal ArticleDOI

Sputtering of compound semiconductor surfaces. II: Compositional changes and radiation-induced topography and damage

TLDR
In this paper, the effects of ion sputtering on the surface layers of multicomponent targets are discussed, and it is shown that the changes are due to radiation-induced diffusion and segregation effects.
Abstract
Ion bombardment often leads to compositional changes in the surface layers of multicomponent targets. Such changes due to noble gas ion sputtering are discussed for InP and GaAs. The analyses show that the compositional change in InP (i.e., indium enrichment) is mainly due to preferential sputtering. In the case of GaAs. the changes are due to radiation-induced diffusion and segregation effects. Brief mention is made of compositional changes in a few other systems. The discussion on sputter-induced topography development deals mainly with InP because ion bombardment leads to dramatic topographical effects in this material. Ripple development on GaAs is also briefly discussed. Radiation damage has been well researched, and its mechanism and effects usually differ substantially when going from one semiconductor group to another. Bombardment-induced damage is briefly discussed for InP, GaAs, SiC, some II-VI semiconductors, and HgCdTe.

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Citations
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Journal ArticleDOI

Trends in sputtering

TL;DR: In this article, the authors summarize the trends observed when elemental and multicomponent materials are exposed to energetic ion beams, focusing on low-energy (low-energy) sputtering.
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McGraw-Hill Encyclopedia of Science and Technology

TL;DR: Unlike other encyclopedias it contains almost no historical or biographical discussions, but to allow for longer essays consists entirely of modern factual presentations of scientific subjects.
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Plasma-polymer interactions: A review of progress in understanding polymer resist mask durability during plasma etching for nanoscale fabrication

TL;DR: In this paper, an organic film-based image is produced, which is subsequently transferred by plasma etching techniques into underlying films/substrates to produce nanoscale materials templates.
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Universal equation for argon gas cluster sputtering yields.

TL;DR: In this article, an analysis is made of the sputtering yields of materials for argon gas cluster ion beams used in SIMS and XPS as a function of the beam energy, E, and the cluster size, n.
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Diffusion of fission products and radiation damage in SiC

TL;DR: In this paper, the diffusion of the important fission products (silver, caesium, iodine and strontium) in polycrystalline 3C-SiC is discussed.
References
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Journal ArticleDOI

Ion channeling study of P implantation damage in CdTe

TL;DR: In this article, the authors describe the evolution of the damage resulting from P implantation in CdTe as a function of fluence and implantation energy, and investigate the damage produced.
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Examination of MBE GaAs/Al0.3Ga0.7As superlattices by Auger electron spectroscopy

TL;DR: In this article, the authors examined the periodic nature of the superlattice structure through all ten periods, although the Al signal did not appear to drop to zero in the GaAs layers, probably due to sputter effects.
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LEED analysis of the principal nonpolar (112̄0) and (101̄0) surfaces of cadmium sulfide

TL;DR: In this article, a LEED analysis of the clean (1120 and (1010) nonpolar surfaces of CdS prepared by an ion bombardment−thermal anneal technique reveals that only integral−order beams are observed with both surfaces.
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Raman-scattering and optical studies of argon-etched GaAs surfaces

TL;DR: The damage layer caused by argon etching appears to be characterized by a very high density of point defects, which previous work suggests may be arsenic vacancies.
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Effects of implantation and annealing temperatures on implantation induced damage in HgCdTe

TL;DR: A preliminary investigation of the effects of implantation and annealing temperatures on implantation induced damage in HgCdTe was undertaken as discussed by the authors, where Rutherford backscattering (RBS) channeling experiments were used to study the surface condition and distribution of implanted induced defects in the crystal.
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